W25Q16DVSVIP datasheet(4/81 Pages) WINBOND

4 / 81 page

W25Q16DV

7.2.38

Program Security Registers (42h) ......................................................................................59

- 4 -

7.2.39

Read Security Registers (48h) ...........................................................................................60

7.2.40

Enable Reset (66h) and Reset (99h)..................................................................................61

ELECTRICAL CHARACTERISTICS............................................................................................... 62

8.1

Absolute Maximum Ratings................................................................................................ 62

8.2

Operating Ranges............................................................................................................... 62

8.3

Power-Up Power-Down Timing and Requirements............................................................ 63

8.4

DC Electrical Characteristics .............................................................................................. 64

8.5

AC Measurement Conditions.............................................................................................. 65

8.6

AC Electrical Characteristics .............................................................................................. 66

8.7

AC Electrical Characteristics (cont’d) ................................................................................. 67

8.8

Serial Output Timing........................................................................................................... 68

8.9

Serial Input Timing.............................................................................................................. 68

8.10

HOLD Timing...................................................................................................................... 68

8.11

WP Timing.......................................................................................................................... 68

PACKAGE SPECIFICATION .......................................................................................................... 69

9.1

8-Pin SOIC 150-mil (Package Code SN)............................................................................ 69

9.2

8-Pin VSOP 150-mil (Package Code SV)........................................................................... 70

9.3

8-Pin SOIC 208-mil (Package Code SS)............................................................................ 71

9.4

8-Pin VSOP 208-mil (Package Code ST)........................................................................... 72

9.5

8-Pin PDIP 300-mil (Package Code DA) ............................................................................ 73

9.6

8-Pad WSON 6x5mm (Package Code ZP) ........................................................................ 74

9.7

16-Pin SOIC 300-mil (Package Code SF) .......................................................................... 76

9.8

24-Ball TFBGA 8x6-mm (Package Code TB, 5x5-1 ball array).......................................... 77

9.9

24-Ball TFBGA 8x6-mm (Package Code TC, 6x4 ball array)............................................. 78

10.

ORDERING INFORMATION .......................................................................................................... 79

10.1

Valid Part Numbers and Top Side Marking ........................................................................ 80

11.

REVISION HISTORY...................................................................................................................... 81

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