MCP1710T-18ISLASHLZ datasheet(4/26 Pages) MICROCHIP

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MCP1710

DS25158A-page 4

 2012 Microchip Technology Inc.

Dropout Voltage

VDROPOUT

——

450

IOUT = 200 mA

1.2V

 V

R  3.5V, Note 3

——

400

Iout = 100mA

3.5V

 V

R  5.5V, Note 3

Shutdown Input

Logic High Input

VSHDN-HIGH

——

%VIN

VIN = 2.7V to 5.5V

Logic Low Input

VSHDN-LOW

——

%VIN

VIN = 2.7V to 5.5V

AC Performance

Output Delay From SHDN

TOR

—

SHDN = GND to VIN,

VOUT = GND to 95% VR

Output Noise

—0.37

—

µV/

Hz I

OUT =50mA, f = 1kHz,

COUT = 2.2 µF (X7R Ceramic)

VOUT =2.5V

Power Supply Ripple Rejec-

tion Ratio

PSRR

—

f = 100 Hz, IOUT =10 mA,

VINAC =200 mV pk-pk,

CIN =0 µF

TEMPERATURE SPECIFICATIONS

Electrical Specifications: Unless otherwise noted, VIN =VR +800 mV, V IN(min) =VR + 0.3V, VIN(max) =5.5V,

Note 1, IOUT =1 mA, CIN =COUT = 2.2 µF (X7R Ceramic), TA =+25°C. Boldface type applies for junction

temperatures, TJ (Note 4) of -40°C to +85°C

Parameters

Sym

Min

Typ

Max

Units

Conditions

Temperature Ranges

Operating Junction

Temperature Range

-40

—

+85

°C

Steady State

Maximum Junction

Temperature

——

+150

°C

Transient

Storage Temperature Range

-65

—

+150

°C

Thermal Package Resistances

Thermal Resistance,

2x 2 VDFN-8



—

73.1

—

°C/W

FR4 Board Only

1 oz. Copper JEDEC Standard Board

with Thermal Vias



—10.7—

°C/W

AC/DC CHARACTERISTICS (CONTINUED)

Electrical Specifications: Unless otherwise noted, VIN =VR + 800 mV, V IN(min) =VR + 0.3V, VIN(max) =5.5V,

Note 1, IOUT =1 mA, CIN =COUT = 2.2 µF (X7R Ceramic), TA =+25°C. Boldface type applies for junction

temperatures, TJ (Note 4) of -40°C to +85°C

Parameters

Sym

Min

Typ

Max

Units

Conditions

Note 1:

The minimum VIN must meet two conditions: VIN  2.7V and VIN  VR  VDROPOUT(MAX).

VR is the nominal regulator output voltage. VR = 1.2V, 2.5V, etc.

Dropout voltage is defined as the input-to-output voltage differential at which the output voltage drops 3%

below its nominal value that was measured with an input voltage of VIN =VOUT(MAX) +VDROPOUT(MAX).

The junction temperature is approximated by soaking the device under test at an ambient temperature

equal to the desired junction temperature. The test time is small enough such that the rise in the junction

temperature over the ambient temperature is not significant.

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