MOTOROLA

MC68EC030 TECHNICAL DATA

2 1

The total thermal resistance of a package (

representing the barrier to heat flow from the semiconductor junction to the package (case) surface (

and from the case to the outside ambient air (

(4)

be minimized by such thermal management techniques as heat sinks, ambient air cooling, and thermal

convection. Thus, good thermal management on the part of the user can significantly reduce

semiconductor junction temperature.

Values for thermal resistance presented in this document, unless estimated, were derived using the

procedure described in Motorola Reliability Report 7843, “Thermal Resistance Measurement Method for

MC68XX Microcomponent Devices,” and are provided for design purposes only. Thermal measurements

are complex and dependent on procedure and setup. User derived values for thermal resistance may

differ.

AC ELECTRICAL SPECIFICATION DEFINITIONS

The AC specifications presented consist of output delays, input setup and hold times, and signal skew

times. All signals are specified relative to an appropriate edge of the clock and possibly to one or more

other signals.

The measurement of the AC specifications is defined by the waveforms shown in Figure 9. To test the

parameters guaranteed by Motorola, inputs must be driven to the voltage levels specified in Figure 9.

Outputs are specified with minimum and/or maximum limits, as appropriate, and are measured as shown in

Figure 9. Inputs are specified with minimum setup and hold times, and are measured as shown. Finally,

the measurement for signal-to-signal specifications is also shown.

Note that the testing levels used to verify conformance to the AC specifications does not affect the

guaranteed DC operation of the device as specified in the DC electrical specifications.

Freescale Semiconductor, Inc.

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