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MPC8260EC Datasheet(PDF) 37 Page - Freescale Semiconductor, Inc |
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MPC8260EC Datasheet(HTML) 37 Page - Freescale Semiconductor, Inc |
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37 / 41 page ![]() MPC8260 PowerQUICC II Integrated Communications Processor Hardware Specifications, Rev. 2 Freescale Semiconductor 37 Package Description 5 Package Description The following sections provide the package parameters and mechanical dimensions for the MPC8260. 5.1 Package Parameters Package parameters are provided in Table 16. The package type is a 37.5 × 37.5 mm, 480-lead TBGA. UTS Indicates that a signal is part of the UTOPIA slave interface UT8 Indicates that a signal is part of the 8-bit UTOPIA interface UT16 Indicates that a signal is part of the 16-bit UTOPIA interface MII Indicates that a signal is part of the media independent interface Table 16. Package Parameters Parameter Value Package Outline 37.5 x 37.5 mm Interconnects 480 (29 x 29 ball array) Pitch 1.27 mm Nominal unmounted package height 1.55 mm Table 15. Symbol Legend (continued) Symbol Meaning |
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