ADP170AUJZ-2.8-R7 datasheet(15/20 Pages) AD

15 / 20 page

ADP170/ADP171

Rev. B | Page 15 of 20

140

120

100

VIN – VOUT (V)

ILOAD = 1mA

ILOAD = 10mA

ILOAD = 25mA

ILOAD = 100mA

ILOAD = 150mA

ILOAD = 300mA

TJ MAX

0.5

1.0

1.5

2.0

2.5

3.0

Figure 35. 0 mm2 of PCB Copper, TA = 25°C

140

120

100

VOUT – VIN (V)

ILOAD = 1mA

ILOAD = 10mA

ILOAD = 25mA

ILOAD = 100mA

ILOAD = 150mA

ILOAD = 300mA

TJ MAX

0.5

1.0

1.5

2.0

2.5

3.0

Figure 36. 500 mm2 of PCB Copper, TA = 50°C

140

120

100

VOUT – VIN (V)

ILOAD = 1mA

ILOAD = 25mA

ILOAD = 100mA

ILOAD = 150mA

ILOAD = 300mA

TJ MAX

ILOAD = 10mA

0.5

1.0

1.5

2.0

2.5

3.0

Figure 37. 100 mm2 of PCB Copper, TA = 50°C

140

120

100

VOUT – VIN (V)

ILOAD = 1mA

ILOAD = 25mA

ILOAD = 100mA

ILOAD = 150mA

ILOAD = 300mA

TJ MAX

ILOAD = 10mA

0.5

1.0

1.5

2.0

2.5

3.0

Figure 38. 0 mm2 of PCB Copper, TA = 50°C

In cases where board temperature is known, use the thermal

characterization parameter, ΨJB, to estimate the junction tem-

perature rise (see Figure 39). Maximum junction temperature

(TJ) is calculated from the board temperature (TB) and power

dissipation (PD) using the following formula:

TJ = TB + (PD × ΨJB)

(5)

The typical value of ΨJB is 42.8°C/W for the 5-lead TSOT package.

140

120

100

VIN – VOUT (V)

ILOAD = 1mA

ILOAD = 10mA

ILOAD = 50mA

ILOAD = 100mA

ILOAD = 150mA

ILOAD = 250mA

ILOAD = 300mA

TJ MAX

0.4

0.8

1.2

1.6

2.0

2.4

2.8

Figure 39. TSOT, TA = 85°C

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