BAS16LD

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Product data sheet

Rev. 1 — 12 October 2010

7 of 11

NXP Semiconductors

BAS16LD

Single high-speed switching diode

9.

Package outline

10. Packing information

[1]

For further information and the availability of packing methods, see Section 14.

11. Soldering

Fig 8.

Package outline BAS16LD (SOD882D)

10-08-06

Dimensions in mm

0.65

0.30

0.22

0.30

0.22

0.55

0.45

0.65

0.55

0.4

max

1.05

0.95

2

cathode marking on top side

1

Table 8.

Packing methods

The indicated -xxx are the last three digits of the 12NC ordering code.[1]

Type number

Package

Description

Packing quantity

10000

BAS16LD

SOD882D

2 mm pitch, 8 mm tape and reel

-315

Reflow soldering is the only recommended soldering method.

Fig 9.

Reflow soldering footprint BAS16LD (SOD882D)

solder lands

solder resist

solder paste

sod882d_fr

Dimensions in mm

1.4

0.2

0.3

0.4

1

1.3

0.8

(2

×)

0.6

(2

×)

0.7

(2

×)