AD8691/AD8692/AD8694

Rev. E | Page 5 of 16

ABSOLUTE MAXIMUM RATINGS

THERMAL CHARACTERISTICS

soldered in the circuit board for surface-mount packages.

Table 3.

Parameter

Rating

Supply Voltage

6 V

Input Voltage

Differential Input Voltage

±6 V

Output Short-Circuit Duration

to GND

Observe derating curves

Storage Temperature Range

−65°C to +150°C

Operating Temperature Range

−40°C to +125°C

Junction Temperature Range

−65°C to +150°C

Lead Temperature

(Soldering, 60 sec)

300°C

Table 4. Thermal Resistance

Package Type

Unit

8-Lead MSOP (RM-8)

210

45

°C/W

8-Lead SOIC (R-8)

158

43

°C/W

5-Lead TSOT (UJ-5)

207

61

°C/W

5-Lead SC70 (KS-5)

376

126

°C/W

14-Lead TSSOP (RU-14)

180

35

°C/W

14-Lead SOIC (R-14)

120

36

°C/W

ESD CAUTION

Stresses above those listed under Absolute Maximum Ratings

may cause permanent damage to the device. This is a stress

rating only; functional operation of the device at these or any

other conditions above those indicated in the operational

section of this specification is not implied. Exposure to absolute

maximum rating conditions for extended periods may affect

device reliability.