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ASMT-BX20 Datasheet(PDF) 2 Page - AVAGO TECHNOLOGIES LIMITED |
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ASMT-BX20 Datasheet(HTML) 2 Page - AVAGO TECHNOLOGIES LIMITED |
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2 / 6 page ![]() Device Selection Guide Part Number Die Technology Color Package Description ASMT-BA0 AlInGaP Amber Untinted, Non-diffused ASMT-BG0 AlInGaP Green Untinted, Non-diffused ASMT-BR0 AlInGaP Red Untinted, Non-diffused ASMT-BB0 InGaN Blue Untinted, Non-diffused Part Numbering System Absolute Maximum Ratings at TA = 25°C Parameter AlInGaP InGaN Units DC Forward Current[1] 30 0 mA Reverse Voltage (IR = 100mA) 5 5 V LED Junction Temperature 95 95 °C Operating Temperature Range -40 to +85 °C Storage Temperature Range -40 to +85 °C Soldering Temperature (Pb Free) 60°C for 10 seconds Electrical Characteristics at TA = 25°C Part Number Forward Voltage VF (Volts) [1]@ IF = 20mA Typ. Reverse Breakdown VR (Volts) @ IR = 100μA Min. Thermal Resistance RθJ-PIN(°C/W) Typ. AlInGaP Amber .0 5 450 AlInGaP Green .0 5 450 AlInGaP Red .0 5 450 InGaN Blue 3. 5 450 Notes: 1. Vf tolerance : ±0.1V ASMT - B x 20 - x x x x 0 Color Bin Selection Please refer to the Color Bin Limits Table. Max Iv Bin Options Please refer to the Iv Bin Table Min Iv Bin Options Please refer to the Iv Bin Table Die Technology A: AllnGaP N: InGaN Color A: Amber G: Green R: Red B: Blue |
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