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DSPIC33FJMC202ESS Datasheet(PDF) 283 Page - Microchip Technology |
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DSPIC33FJMC202ESS Datasheet(HTML) 283 Page - Microchip Technology |
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283 / 330 page ![]() © 2007-2012 Microchip Technology Inc. DS70283K-page 283 dsPIC33FJ32MC202/204 and dsPIC33FJ16MC304 TABLE 25-4: DC CHARACTERISTICS: POWER-DOWN CURRENT (IPD) TABLE 25-5: DC CHARACTERISTICS: OPERATING CURRENT (IDD) TABLE 25-6: DC CHARACTERISTICS: DOZE CURRENT (IDOZE) DC CHARACTERISTICS Standard Operating Conditions: 3.0V to 3.6V (unless otherwise stated) Operating temperature -40°C ≤TA ≤+150°C for High Temperature Parameter No. Typical Max Units Conditions Power-Down Current (IPD) HDC60e 250 2000 μA +150°C 3.3V Base Power-Down Current(1,3) HDC61c 3 5 μA +150°C 3.3V Watchdog Timer Current: ΔIWDT(2,4) Note 1: Base IPD is measured with all peripherals and clocks shut down. All I/Os are configured as inputs and pulled to VSS. WDT, etc., are all switched off, and VREGS (RCON<8>) = 1. 2: The Δ current is the additional current consumed when the module is enabled. This current should be added to the base IPD current. 3: These currents are measured on the device containing the most memory in this family. 4: These parameters are characterized, but are not tested in manufacturing. DC CHARACTERISTICS Standard Operating Conditions: 3.0V to 3.6V (unless otherwise stated) Operating temperature -40°C ≤TA ≤+150°C for High Temperature Parameter No. Typical(1) Max Units Conditions HDC20 19 35 mA +150°C 3.3V 10 MIPS HDC21 27 45 mA +150°C 3.3V 16 MIPS HDC22 33 55 mA +150°C 3.3V 20 MIPS Note 1: These parameters are characterized, but are not tested in manufacturing. DC CHARACTERISTICS Standard Operating Conditions: 3.0V to 3.6V (unless otherwise stated) Operating temperature -40°C ≤TA ≤+150°C for High Temperature Parameter No. Typical(1) Max Doze Ratio Units Conditions HDC72a 39 45 1:2 mA +150°C 3.3V 20 MIPS HDC72f 18 25 1:64 mA HDC72g 18 25 1:128 mA Note 1: Parameters with Doze ratios of 1:2 and 1:64 are characterized, but are not tested in manufacturing. |
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