DPG 60 C 300 QB

I

RMS

A

per pin

50

K/W

0.25

M

D

Nm

1.2

mounting torque

0.8

T

stg

°C

150

storage temperature

-55

Weight

g

5

Symbol

Definition

Ratings

typ.

max.

min.

Conditions

RMS current

thermal resistance case to heatsink

Unit

I

is typically limited by: 1. pin-to-chip resistance; or by 2. current capability of the chip.

In case of 1, a common cathode/anode configuration and a non-isolated backside, the whole current capability can be used by connecting

the backside.

F

C

N

120

mounting force with clip

20

Ordering

Delivering Mode

Base Qty Code Key

Standard

Part Name

DPG 60 C 300 QB

501894

Tube

30

Product Marking

Date Code

Part No.

Logo

Order Code

IXYS

abcd

D

P

G

60

C

300

QB

Part number

Diode

HiPerFRED

extreme fast

Common Cathode

TO-3P (3)

=

=

=

DPG60C300HB

DPG60C300HJ

DPG60C300PC

DPF60C300HB

TO-247AD (3)

ISOPLUS247 (3)

TO-263AB (D2Pak)

TO-247AD (3)

Similar Part

Package

1)

1)

Marking on Product

DPG60C300QB

300

300

300

300

Voltage Class

Current Rating [A]

Reverse Voltage [V]

=

=

=

=

RMS

DPG80C300HB

TO-247AD (3)

300

IXYS reserves the right to change limits, conditions and dimensions.

©

20100125b

Data according to IEC 60747and per diode unless otherwise specified

2010 IXYS all rights reserved