Electronic Components Datasheet Search
  New Zealand  ▼
ALLDATASHEET.CO.NZ

X  

CC1206CKX7RDBB Datasheet(PDF) 13 Page - YAGEO Corporation

Part # CC1206CKX7RDBB
Description  SURFACE-MOUNT CERAMIC MULTILAYER CAPACITORS
PDF  16 Pages
Scroll/Zoom Zoom In 100%  Zoom Out
Manufacturer  YAGEO [YAGEO Corporation]
Direct Link  http://www.yageo.com
Logo YAGEO - YAGEO Corporation

CC1206CKX7RDBB Datasheet(HTML) 13 Page - YAGEO Corporation

Back Button CC1206CKX7RDBB Datasheet HTML 8Page - YAGEO Corporation CC1206CKX7RDBB Datasheet HTML 9Page - YAGEO Corporation CC1206CKX7RDBB Datasheet HTML 10Page - YAGEO Corporation CC1206CKX7RDBB Datasheet HTML 11Page - YAGEO Corporation CC1206CKX7RDBB Datasheet HTML 12Page - YAGEO Corporation CC1206CKX7RDBB Datasheet HTML 13Page - YAGEO Corporation CC1206CKX7RDBB Datasheet HTML 14Page - YAGEO Corporation CC1206CKX7RDBB Datasheet HTML 15Page - YAGEO Corporation CC1206CKX7RDBB Datasheet HTML 16Page - YAGEO Corporation  
Zoom Inzoom in Zoom Outzoom out
 13 / 16 page
background image
High-Voltage
NP0
/X7R 1 KV to 3 KV
www.yageo.com
Aug 08, 2011 V.4
Surface-Mount Ceramic Multilayer Capacitors
13
16
Product specification
TEST
TEST METHOD
PROCEDURE
REQUIREMENTS
Adhesion
IEC 60384-
21/22
4.7
A force applied for 10 seconds to the line joining
the terminations and in a plane parallel to the
substrate
Force
size ≥ 0603: 5N
Mounting in accordance with IEC 60384-22
paragraph 4.3
No visible damage
Bond
Strength of
Plating on
End Face
4.8
Conditions: bending 1 mm at a rate of 1 mm/s,
radius jig 340 mm
∆C/C
Class 1:
NP0: within ±1% or 0.5 pF, whichever is greater
Class2:
X7R: ±10%
Dissolution of the end face plating shall not
exceed 25% of the length of the edge
concerned
∆C/C
Class 1:
NP0: within ±0.5% or 0.5 pF, whichever is greater
Class2:
X7R: ±10%
Resistance to
Soldering
Heat
4.9
Precondition: 150 +0/–10 °C for 1 hour, then
keep for 24 ±1 hours at room temperature
Preheating: for size ≤ 1206: 120 °C to 150 °C for
1 minute
Preheating: for size >1206: 100 °C to 120 °C for
1 minute and 170 °C to 200 °C for 1 minute
Solder bath temperature: 260 ±5 °C
Dipping time: 10 ±0.5 seconds
Recovery time: 24 ±2 hours
D.F. within initial specified value
Rins within initial specified value
Solderability
4.10 Preheated to a temperature of 80 °C to 140 °C
and maintained for 30 seconds to 60 seconds.
Test conditions for lead containing solder alloy
Temperature: 235 ±5 °C
Dipping time: 2 ±0.2 seconds
Depth of immersion: 10 mm
Alloy Composition: 60/40 Sn/Pb
Number of immersions: 1
Test conditions for lead-free containing
solder alloy
Temperature: 245 ±5 °C
Dipping time: 3 ±0.3 seconds
Depth of immersion: 10 mm
Alloy Composition: SAC305
Number of immersions: 1
The solder should cover over 95% of the critical
area of each termination



Html Pages

1 2 3 4 5 6 7 8 9 10 11 12 13 14 15 16


Datasheet Download

Go To PDF Page


Link URL



Does ALLDATASHEET help your business so far?  [ DONATE ] 

About Alldatasheet   |   Advertisement   |   Contact us   |   Privacy Policy   |   Link to Datasheet    |   Link Exchange   |   Manufacturer List
All Rights Reserved©Alldatasheet.com


Mirror Sites
English : Alldatasheet.com  |   English : Alldatasheet.net  |   Chinese : Alldatasheetcn.com  |   German : Alldatasheetde.com  |   Japanese : Alldatasheet.jp
Russian : Alldatasheetru.com  |   Korean : Alldatasheet.co.kr  |   Spanish : Alldatasheet.es  |   French : Alldatasheet.fr  |   Italian : Alldatasheetit.com
Portuguese : Alldatasheetpt.com  |   Polish : Alldatasheet.pl  |   Vietnamese : Alldatasheet.vn
Indian : Alldatasheet.in  |   Mexican : Alldatasheet.com.mx  |   British : Alldatasheet.co.uk  |   New Zealand : Alldatasheet.co.nz
Family Site : ic2ic.com  |   icmetro.com