STPS1H100MF datasheet(4/7 Pages) STMICROELECTRONICS

4 / 7 page

Characteristics

STPS1H100MF

4/7

Figure 7.

Relative variation of thermal

impedance, junction to ambient,

versus pulse duration (epoxy

printed circuit board, copper

thickness = 35 µm, recommended

pad layout)

Figure 8.

Thermal resistance, junction to

ambient, versus copper surface

under each lead (epoxy

printed board FR4,

copper thickness = 35 µm)

Figure 9.

Reverse leakage current versus

voltage applied (typical values)

Figure 10.

Junction capacitance versus

reverse voltage applied (typical

values)

Z/R

th(j-a)

0.0

0.1

0.2

0.3

0.4

0.5

0.6

0.7

0.8

0.9

1.0

1.E-02

1.E-01

1.E+00

1.E+01

1.E+02

1.E+03

Single pulse

t (s)

100

125

150

175

200

225

250

0.0

0.5

1.0

1.5

2.0

2.5

3.0

3.5

4.0

4.5

5.0

Rth(j-a) (°C/W)

(cm )

I (µA)

1.E-03

1.E-02

1.E-01

1.E+00

1.E+01

1.E+02

1.E+03

1.E+04

2040

6080

100

j=150 °C

j=125 °C

j=25 °C

j=100 °C

j=75 °C

j=50 °C

V (V)

C(pF)

100

F=1 MHz

OSC=30 mVRMS

j=25 °C

V (V)

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