PIC18F2610ESLASHSOSQTP datasheet(318/376 Pages) MICROCHIP

318 / 376 page

PIC18F2X1X/4X1X

DS39636D-page 320

Supply Current (IDD)(2,3)

PIC18LF2X1X/4X1X

165

350

μA-40°C

VDD = 2.0V

FOSC = 1 MHz

(RC_IDLE mode,

INTOSC source)

175

350

μA+25°C

190

350

μA+85°C

PIC18LF2X1X/4X1X

250

500

μA-40°C

VDD = 3.0V

270

500

μA+25°C

290

500

μA+85°C

All devices 500

-40°C

VDD = 5.0V

520

+25°C

550

+85°C

Extended devices only

0.6

2.9

+125°C

PIC18LF2X1X/4X1X

340

500

μA-40°C

VDD = 2.0V

FOSC = 4 MHz

(RC_IDLE mode,

INTOSC source)

350

500

μA+25°C

360

500

μA+85°C

PIC18LF2X1X/4X1X

520

900

μA-40°C

VDD = 3.0V

540

900

μA+25°C

580

900

μA+85°C

All devices

1.0

1.6

-40°C

VDD = 5.0V

1.1

1.5

+25°C

1.1

1.4

+85°C

Extended devices only

1.1

5.0

+125°C

25.2

DC Characteristics:

Power-Down and Supply Current

PIC18F2X1X/4X1X (Industrial)

PIC18LF2X1X/4X1X (Industrial) (Continued)

PIC18LF2X1X/4X1X

(Industrial)

Standard Operating Conditions (unless otherwise stated)

Operating temperature

-40°C

≤ TA ≤ +85°C for industrial

PIC18F2X1X/4X1X

(Industrial, Extended)

Standard Operating Conditions (unless otherwise stated)

Operating temperature

-40°C

≤ TA ≤ +85°C for industrial

-40°C

≤ TA ≤ +125°C for extended

ParamNo.

Device

Typ

Max

Units

Conditions

Legend:

Shading of rows is to assist in readability of the table.

Note 1:

The power-down current in Sleep mode does not depend on the oscillator type. Power-down current is measured

with the part in Sleep mode, with all I/O pins in high-impedance state and tied to VDD or VSS and all features that

add delta current disabled (such as WDT, Timer1 Oscillator, BOR, etc.).

The supply current is mainly a function of operating voltage, frequency and mode. Other factors, such as I/O pin

loading and switching rate, oscillator type and circuit, internal code execution pattern and temperature, also have

an impact on the current consumption.

The test conditions for all IDD measurements in active operation mode are:

OSC1 = external square wave, from rail-to-rail; all I/O pins tri-stated, pulled to VDD;

MCLR = VDD; WDT enabled/disabled as specified.

For RC oscillator configurations, current through REXT is not included. The current through the resistor can be

estimated by the formula Ir = VDD/2REXT (mA) with REXT in k

Ω.

Low-power Timer1 oscillator selected.

BOR and HLVD enable internal band gap reference. With both modules enabled, current consumption will be less

than the sum of both specifications.

PIC18F2610E/SOSQTP Datasheet(PDF) 318 Page - Microchip Technology

PIC18F2610E/SOSQTP Datasheet(HTML) 318 Page - Microchip Technology

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