ADP1720

Rev. A | Page 14 of 16

PRINTED CIRCUIT BOARD LAYOUT

CONSIDERATIONS

R1

C2

C1

ADP1720

IN

OUT

GND (TOP)

R2

EN

GND (BOTTOM)

Heat dissipation from the package can be improved by increasing

the amount of copper attached to the pins of the ADP1720. How-

ever, as can be seen from Table 5, a point of diminishing returns

eventually is reached, beyond which an increase in the copper

size does not yield significant heat dissipation benefits.

Place the input capacitor as close as possible to the IN and GND

pins. Place the output capacitor as close as possible to the OUT

and GND pins. Use of 0402 or 0603 size capacitors and resistors

achieves the smallest possible footprint solution on boards

where area is limited.

Figure 28. Example PCB Layout