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ADG904BCPZ-R-REEL Datasheet(PDF) 14 Page - Analog Devices |
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ADG904BCPZ-R-REEL Datasheet(HTML) 14 Page - Analog Devices |
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14 / 17 page ![]() Data Sheet ADG904/ADG904-R Rev. C | Page 13 of 16 OUTLINE DIMENSIONS COMPLIANT TO JEDEC STANDARDS MO-153-AC 20 1 11 10 6.40 BSC 4.50 4.40 4.30 PIN 1 6.60 6.50 6.40 SEATING PLANE 0.15 0.05 0.30 0.19 0.65 BSC 1.20 MAX 0.20 0.09 0.75 0.60 0.45 8° 0° COPLANARITY 0.10 Figure 31. 20-Lead Thin Shrink Small Outline Package [TSSOP] (RU-20) Dimensions shown in millimeters 0.50 BSC 0.65 0.60 0.55 0.30 0.25 0.18 COMPLIANT TO JEDEC STANDARDS MO-220-WGGD-1. BOTTOM VIEW TOP VIEW EXPOSED PAD PIN 1 INDICATOR 4.10 4.00 SQ 3.90 SEATING PLANE 0.80 0.75 0.70 0.05 MAX 0.02 NOM 0.20 REF 0.20 MIN COPLANARITY 0.08 PIN 1 INDICATOR 2.30 2.10 SQ 2.00 FOR PROPER CONNECTION OF THE EXPOSED PAD, REFER TO THE PIN CONFIGURATION AND FUNCTION DESCRIPTIONS SECTION OF THIS DATA SHEET. 1 20 6 10 11 15 16 5 Figure 32. 20-Lead Lead Frame Chip Scale Package [LFCSP_WQ] 4 mm × 4 mm Body, Very Very Thin Quad (CP-20-6) Dimensions shown in millimeters |
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