AD8099ACPZ-R2 datasheet(25/29 Pages) AD

25 / 29 page

AD8099

Data Sheet

Rev. D | Page 24 of 28

OUTLINE DIMENSIONS

COMPLIANT TO JEDEC STANDARDS MS-012-A A

1.27

0.40

1.75

1.35

2.29

0.356

0.457

4.00

3.90

3.80

6.20

6.00

5.80

5.00

4.90

4.80

0.10 MAX

0.05 NOM

3.81 REF

0.25

0.17

8°

0°

0.50

0.25

45°

COPLANARITY

0.10

1.04 REF

1.27 BSC

SEATING

PLANE

FOR PROPER CONNECTION OF

THE EXPOSED PAD, REFER TO

THE CONNECTION DIAGRAMS

SECTION OF THIS DATA SHEET.

BOTTOM VIEW

TOP VIEW

0.51

0.31

1.65

1.25

Figure 72. 8-Lead Standard Small Outline Package, with Exposed Pad [SOIC_N_EP]

Narrow Body

(RD-8-1)

Dimensions shown in millimeters

EXPOSED

PAD

(BOTTOM VIEW)

0.50

BSC

PIN 1

INDICATOR

0.50

0.40

0.30

TOP

VIEW

12° MAX

0.70 MAX

0.65 TYP

0.90 MAX

0.85 NOM

0.05 MAX

0.01 NOM

0.20 REF

1.89

1.74

1.59

1.60

1.45

1.30

3.25

3.00 SQ

2.75

2.95

2.75 SQ

2.55

PIN 1

INDICATOR

SEATING

PLANE

0.30

0.23

0.18

0.60 MAX

FOR PROPER CONNECTION OF

THE EXPOSED PAD, REFER TO

THE CONNECTION DIAGRAMS

SECTION OF THIS DATA SHEET.

Figure 73. 8-Lead Lead Frame Chip Scale Package [LFCSP_VD]

3 mm × 3 mm Body, Very Thin, Dual Lead

(CP-8-2)

Dimensions shown in millimeters

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