3.5

Tinned copper alloy

All EPCOS CU types with tinned termination are approved for lead-free and SnPb soldering.

3.6

Tinned iron wire

All EPCOS SHCV types with tinned termination are approved for lead-free and SnPb soldering.

4

Solder joint profiles / solder quantity

4.1

Nickel barrier termination

If the meniscus height is too low, that means the solder quantity is too low, the solder joint may

break, i.e. the component becomes detached from the joint. This problem is sometimes interpret-

ed as leaching of the external terminations.

If the solder meniscus is too high, i.e. the solder quantity is too large, the vise effect may occur.

As the solder cools down, the solder contracts in the direction of the component. If there is too

much solder on the component, it has no leeway to evade the stress and may break, as in a vise.

The figures below show good and poor solder joints for dual-wave and infrared soldering.

4.1.1

Solder joint profiles for nickel barrier termination - dual-wave soldering

Good and poor solder joints caused by amount of solder in dual-wave soldering.

4.1.2

Solder joint profiles for nickel barrier termination / silver-palladium / silver-platinum

termination - reflow soldering

Multilayer varistors (MLVs)

Telecom series

Page 19 of 30

Please read Cautions and warnings and

Important notes at the end of this document.