A further advantage of adhesion is that the components are subjected to virtually no temperature

shock at all. The curing temperatures of the adhesives are between 120

°C and 180 °C, typical

curing times are between 30 minutes and one hour.

The bending strength of glued chips is, in comparison with that of soldered chips, higher by a fac-

tor of at least 2, as is to be expected due to the elasticity of the glued joints.

The lower conductivity of conductive adhesive may lead to higher contact resistance and thus re-

sult in electrical data different to those of soldered components. Users must pay special attention

to this in RF applications.

6

Solderability tests

Test

Standard

Test conditions

Sn-Pb soldering

Test conditions

Pb-free soldering

Criteria/ test results

Wettability

IEC

60068-2-58

Immersion in

60/40 SnPb solder

using non-activated

flux at 215

± 3 °C

for 3

± 0.3 s

Immersion in

Sn96.5Ag3.0Cu0.5

solder using non- or

low activated flux

at 245

± 5 °C

for 3

± 0.3 s

Covering of 95% of

end termination,

checked by visual

inspection

Leaching

resistance

IEC

60068-2-58

Immersion in

60/40 SnPb

solder using

mildly activated flux

without preheating

at 260

± 5 °C

for 10

±1 s

Immersion in

Sn96.5Ag3.0Cu0.5

solder using non- or

low activated flux

without preheating

at 255

± 5 °C

for 10

±1 s

No leaching of

contacts

Thermal shock

(solder shock)

Dip soldering at

300

°C/5 s

Dip soldering at

300

°C/5 s

No deterioration of

electrical parameters.

Capacitance change:

≤ ±15%

Tests of resistance

to soldering heat

for SMDs

IEC

60068-2-58

Immersion in

60/40 SnPb for 10 s

at 260

°C

Immersion in

Sn96.5Ag3.0Cu0.5

for 10 s at 260

°C

Change of varistor

voltage:

≤ ±5%

Tests of resistance

to soldering heat

for radial leaded

components

(SHCV)

IEC

60068-2-20

Immersion

of leads in

60/40 SnPb

for 10 s at 260

°C

Immersion

of leads in

Sn96.5Ag3.0Cu0.5

for 10 s at 260

°C

Change of varistor

voltage:

≤ ±5%

Change of

capacitance X7R:

≤ 5/+10%

Multilayer varistors (MLVs)

Telecom series

Page 21 of 30

Please read Cautions and warnings and

Important notes at the end of this document.