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MTP23P06VG Datasheet(PDF) 1 Page - ON Semiconductor |
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MTP23P06VG Datasheet(HTML) 1 Page - ON Semiconductor |
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1 / 7 page ![]() © Semiconductor Components Industries, LLC, 2006 June, 2006 − Rev. 4 1 Publication Order Number: MTP23P06V/D MTP23P06V Preferred Device Power MOSFET 23 Amps, 60 Volts P−Channel TO−220 This Power MOSFET is designed to withstand high energy in the avalanche and commutation modes. Designed for low voltage, high speed switching applications in power supplies, converters and power motor controls, these devices are particularly well suited for bridge circuits where diode speed and commutating safe operating areas are critical and offer additional safety margin against unexpected voltage transients. Features • Avalanche Energy Specified • IDSS and VDS(on) Specified at Elevated Temperature • Pb−Free Package is Available* MAXIMUM RATINGS (TC = 25°C unless otherwise noted) Rating Symbol Value Unit Drain−to−Source Voltage VDSS 60 Vdc Drain−to−Gate Voltage (RGS = 1.0 MW) VDGR 60 Vdc Gate−to−Source Voltage − Continuous − Non−repetitive (tp ≤ 10 ms) VGS VGSM ± 15 ± 25 Vdc Vpk Drain Current − Continuous @ 25 °C Drain Current − Continuous @ 100 °C Drain Current − Single Pulse (tp ≤ 10 ms) ID ID IDM 23 15 81 Adc Apk Total Power Dissipation @ 25 °C Derate above 25 °C PD 90 0.60 W W/ °C Operating and Storage Temperature Range TJ, Tstg − 55 to 175 °C Single Pulse Drain−to−Source Avalanche Energy − Starting TJ = 25°C (VDD = 25 Vdc, VGS = 10 Vdc, Peak IL = 23 Apk, L = 3.0 mH, RG = 25 W) EAS 794 mJ Thermal Resistance − Junction−to−Case Thermal Resistance − Junction−to−Ambient RqJC RqJA 1.67 62.5 °C/W Maximum Lead Temperature for Soldering Purposes, 1/8 ″ from Case for 10 seconds TL 260 °C Stresses exceeding Maximum Ratings may damage the device. Maximum Ratings are stress ratings only. Functional operation above the Recommended Operating Conditions is not implied. Extended exposure to stresses above the Recommended Operating Conditions may affect device reliability. *For additional information on our Pb−Free strategy and soldering details, please download the ON Semiconductor Soldering and Mounting Techniques Reference Manual, SOLDERRM/D. D S G P−Channel 23 AMPERES, 60 VOLTS RDS(on) = 120 mW Preferred devices are recommended choices for future use and best overall value. Device Package Shipping ORDERING INFORMATION MTP23P06V TO−220AB 50 Units/Rail http://onsemi.com MTP23P06VG TO−220AB (Pb−Free) 50 Units/Rail TO−220AB CASE 221A STYLE 5 1 2 3 4 MARKING DIAGRAM AND PIN ASSIGNMENT MTP23P06V = Device Code A = Location Code Y = Year WW = Work Week G = Pb−Free Package MTP 23P06VG AYWW 1 Gate 3 Source 4 Drain 2 Drain |
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