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DSPIC30F2011AT-30E/S Datasheet(PDF) 20 Page - Microchip Technology |
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DSPIC30F2011AT-30E/S Datasheet(HTML) 20 Page - Microchip Technology |
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20 / 238 page ![]() dsPIC30F6011A/6012A/6013A/6014A DS70143C-page 18 Preliminary © 2006 Microchip Technology Inc. 2.3 Divide Support The dsPIC DSC devices feature a 16/16-bit signed fractional divide operation, as well as 32/16-bit and 16/ 16-bit signed and unsigned integer divide operations, in the form of single instruction iterative divides. The following instructions and data sizes are supported: 1. DIVF - 16/16 signed fractional divide 2. DIV.sd - 32/16 signed divide 3. DIV.ud - 32/16 unsigned divide 4. DIV.sw - 16/16 signed divide 5. DIV.uw - 16/16 unsigned divide The 16/16 divides are similar to the 32/16 (same number of iterations), but the dividend is either zero-extended or sign-extended during the first iteration. The divide instructions must be executed within a REPEAT loop. Any other form of execution (e.g., a series of discrete divide instructions) will not function correctly because the instruction flow depends on RCOUNT. The divide instruction does not automati- cally set up the RCOUNT value and it must, therefore, be explicitly and correctly specified in the REPEAT instruction as shown in Table 2-1 (REPEAT will execute the target instruction {operand value + 1} times). The REPEAT loop count must be setup for 18 iterations of the DIV/DIVF instruction. Thus, a complete divide operation requires 19 cycles. TABLE 2-1: DIVIDE INSTRUCTIONS Note: The divide flow is interruptible. However, the user needs to save the context as appropriate. Instruction Function DIVF Signed fractional divide: Wm/Wn → W0; Rem → W1 DIV.sd Signed divide: (Wm + 1:Wm)/Wn → W0; Rem → W1 DIV.ud Unsigned divide: (Wm + 1:Wm)/Wn → W0; Rem → W1 DIV.sw Signed divide: Wm/Wn → W0; Rem → W1 DIV.uw Unsigned divide: Wm/Wn → W0; Rem → W1 |
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