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DSPIC30F2011AT-30E/S Datasheet(PDF) 218 Page - Microchip Technology

Part # DSPIC30F2011AT-30E/S
Description  High-Performance, 16-Bit Digital Signal Controllers
PDF  238 Pages
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Manufacturer  MICROCHIP [Microchip Technology]
Direct Link  http://www.microchip.com
Logo MICROCHIP - Microchip Technology

DSPIC30F2011AT-30E/S Datasheet(HTML) 218 Page - Microchip Technology

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dsPIC30F6011A/6012A/6013A/6014A
DS70143C-page 216
Preliminary
© 2006 Microchip Technology Inc.
64-Lead Plastic Thin Quad Flatpack (PT) 10x10x1 mm Body, 1.0/0.10 mm Lead Form (TQFP)
Note:
For the most current package drawings, please see the Microchip Packaging Specification located at
http://www.microchip.com/packaging
15
10
5
15
10
5
β
Mold Draft Angle Bottom
15
10
5
15
10
5
α
Mold Draft Angle Top
0.27
0.22
0.17
.011
.009
.007
B
Lead Width
0.23
0.18
0.13
.009
.007
.005
c
Lead Thickness
16
16
n1
Pins per Side
10.10
10.00
9.90
.398
.394
.390
D1
Molded Package Length
10.10
10.00
9.90
.398
.394
.390
E1
Molded Package Width
12.25
12.00
11.75
.482
.472
.463
D
Overall Length
12.25
12.00
11.75
.482
.472
.463
E
Overall Width
7
3.5
0
7
3.5
0
φ
Foot Angle
0.75
0.60
0.45
.030
.024
.018
L
Foot Length
0.25
0.15
0.05
.010
.006
.002
A1
Standoff
1.05
1.00
0.95
.041
.039
.037
A2
Molded Package Thickness
1.20
1.10
1.00
.047
.043
.039
A
Overall Height
0.50
.020
p
Pitch
64
64
n
Number of Pins
MAX
NOM
MIN
MAX
NOM
MIN
Dimension Limits
MILLIMETERS*
INCHES
Units
Footprint
F
.039 REF.
1.00 REF.
Pin 1 Corner Chamfer
CH
.025
.035
.045
0.64
0.89
1.14
REF: Reference Dimension, usually without tolerance, for information purposes only.
Revised 07-22-05
Dimensions D and E1 do not include mold flash or protrusions. Mold flash or protrusions shall not exceed .010" (0.254mm) per side.
See ASME Y14.5M
* Controlling Parameter
JEDEC Equivalent: MS-026
Notes:
c
2
1
n
D
D1
B
p
#leads=n1
E1
E
A2
A1
A
L
CH x 45°
β
φ
α
F
Drawing No. C04-085



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