THS6062IDGNG4 datasheet(25/36 Pages) TI1

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D +

MAX

–T

(5)

DGNPackage

θJA =58.4°C/W

2oz.TraceAndCopperPad

WithSolder

DGNPackage

θJA =158°C/W

2oz.TraceAnd

CopperPad

WithoutSolder

SOICPackage

High-KTestPCB

θJA =98°C/W

TJ =150°C

SOICPackage

Low-KTestPCB

θJA =167°C/W

1.5

−40

−20

2.5

MAXIMUM POWERDISSIPATION

FREE-AIRTEMPERATURE

3.5

100

0.5

TA − Free-AirTemperature − °C

THS6062

SLOS228D – JANUARY 1999 – REVISED OCTOBER 2007

installed.

The actual thermal performance achieved with the THS6062DGN in its PowerPAD package depends on the

application. In the example above, if the size of the internal ground plane is approximately 3 inches

× 3 inches,

then the expected thermal coefficient,

θJA, is about 58.4°C/W. For comparison, the non-PowerPAD version of the

THS6062 IC (SOIC) is shown. For a given

θJA, the maximum power dissipation is shown in Figure 49 and is

calculated by the following formula:

Where:

PD = Maximum power dissipation of THS6062 IC (watts)

TMAX = Absolute maximum junction temperature (150°C)

TA = Free-ambient air temperature (°C)

θJA = θJC + θCA

θJC = Thermal coefficient from junction to case

θCA = Thermal coefficient from case to ambient air (°C/W)

NOTE: Results are with no air flow and PCB size = 3"

× 3"

Figure 49. Maximum Power Dissipation vs Free-Air Temperature

More complete details of the PowerPAD installation process and thermal management techniques can be found

in the Texas Instruments Technical Brief, PowerPAD Thermally Enhanced Package. This document can be found

at the TI web site (www.ti.com) by searching on the key word PowerPAD. The document can also be ordered

through your local TI sales office. Refer to literature number SLMA002 when ordering.

The next thing that should be considered is the package constraints. The two sources of heat within an amplifier

are quiescent power and output power. The designer should never forget about the quiescent heat generated

within the device, especially a multi-amplifier device. Because these devices have linear output stages (Class

A-B), most of the heat dissipation is at low output voltages with high output currents. Figure 50 and Figure 51

show this effect, along with the quiescent heat, with an ambient air temperature of 50

°C. When using V

CC = 5 V

or ±5 V, there is generally not a heat problem, even with SOIC packages. But, when using VCC = ±15 V, the

SOIC package is severely limited in the amount of heat it can dissipate. The other key factor when looking at

these graphs is how the devices are mounted on the PCB. The PowerPAD devices are extremely useful for heat

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