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PE43404 Datasheet(PDF) 2 Page - Peregrine Semiconductor

Part # PE43404
Description  RF Digital Attenuator
PDF  11 Pages
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Manufacturer  PSEMI [Peregrine Semiconductor]
Direct Link  http://www.psemi.com
Logo PSEMI - Peregrine Semiconductor

PE43404 Datasheet(HTML) 2 Page - Peregrine Semiconductor

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Product Specification
PE43404
Page 2 of 11
©2008 Peregrine Semiconductor Corp. All rights reserved.
Document No. 70-0258-02
│ UltraCMOS™ RFIC Solutions
1
15
14
13
12
11
2
3
4
5
N/C
RF1
Data
Clock
LE
GND
Vss/GND
P/S
RF2
C8
20-lead
QFN
4x4mm
Exposed Solder Pad
Table 2. Pin Descriptions
Electrostatic Discharge (ESD) Precautions
When handling this UltraCMOS™ device, observe
the same precautions that you would use with other
ESD-sensitive devices. Although this device
contains circuitry to protect it from damage due to
ESD, precautions should be taken to avoid
exceeding the rate specified in Table 3.
Exposed Solder Pad Connection
The exposed solder pad on the bottom of the
package must be grounded for proper device
operation.
Notes: 1. Both RF ports must be held at 0 VDC or DC blocked with
an external series capacitor.
2. Latch Enable (LE) has an internal 100 k
Ωresistor to V
DD.
3. Connect pin 12 to GND to enable internal negative
voltage generator. Connect pin 12 to VSS (-VDD) to
bypass and disable internal negative voltage generator.
4. Place a 10 k
Ωresistor in series, as close to pin as
possible to avoid frequency resonance. See “Resistor on
3” paragraph
Figure 15. Pin Configuration (Top View)
Latch-Up Avoidance
Unlike conventional CMOS devices, UltraCMOS™
devices are immune to latch-up.
Switching Frequency
The PE43404 has a maximum 25 kHz switching rate.
Pin
No.
Pin
Name
Description
1
N/C
No connect
2
RF1
RF port (Note 1).
3
Data
Serial interface data input (Note 4).
4
Clock
Serial interface clock input.
5
LE
Latch Enable input (Note 2).
6
VDD
Power supply pin.
7
N/C
No connect
8
PUP2
Power-up selection bit.
9
VDD
Power supply pin.
10
GND
Ground connection.
11
GND
Ground connection.
12
Vss/
GND
Negative supply voltage or GND
connection (Note 3)
13
P/S
Parallel/Serial mode select.
14
RF2
RF port (Note 1).
15
C8
Attenuation control bit, 8 dB.
16
C4
Attenuation control bit, 4 dB.
17
C2
Attenuation control bit, 2 dB.
18
GND
Ground connection.
19
C1
Attenuation control bit, 1 dB.
20
GND
Ground for proper operation
Paddle
GND
Ground for proper operation
Resistor on Pin 3
A 10 k
Ω resistor on the input to Pin 3 (see Figure 5)
will eliminate package resonance between the RF
input pin and the digital input. Specified attenuation
error versus frequency performance is dependent
upon this condition.
Table 3. Absolute Maximum Ratings
Table 4. Operating Ranges
Symbol
Parameter/Conditions
Min
Max
Units
VDD
Power supply voltage
-0.3
4.0
V
VI
Voltage on any input
-0.3
VDD+
0.3
V
TST
Storage temperature range
-65
150
°C
P
IN
Input power (50
Ω)
+30
dBm
VESD
ESD voltage (Human Body
Model)
500
V
Parameter
Min
Typ
Max
Units
VDD Power Supply
Voltage
2.7
3.0
3.3
V
IDD Power Supply
Current
100
µA
Digital Input High
0.7xVDD
V
Digital Input Low
0.3xVDD
V
Digital Input Leakage
1
µA
Input Power
+24
dBm
Temperature range
-40
85
°C
Exceeding absolute maximum ratings may cause
permanent damage. Operation should be restricted
to the limits in the Operating Ranges table.
Operation between operating range maximum and
absolute maximum for extended periods may reduce
reliability.



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