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MP3356 Datasheet(PDF) 2 Page - Monolithic Power Systems

Part # MP3356
Description  High Voltage Photo Flash Charger and IGBT Driver for DSC
PDF  10 Pages
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Manufacturer  MPS [Monolithic Power Systems]
Direct Link  http://www.monolithicpower.com
Logo MPS - Monolithic Power Systems

MP3356 Datasheet(HTML) 2 Page - Monolithic Power Systems

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MP3356 – HIGH VOLTAGE PHOTO FLASH CHARGER AND IGBT DRIVER FOR DSC
MP3356 Rev. 0.91
www.MonolithicPower.com
2
1/29/2010
MPS Proprietary Information. Unauthorized Photocopy and Duplication Prohibited.
© 2010 MPS. All Rights Reserved.
ORDERING INFORMATION
Part Number*
Package
Top Marking
Free Air Temperature (TA)
MP3356DG
10-pin, 2x2 Flip QFN
4PY
–40
°C to +85°C
* For Tape & Reel, add suffix –Z (e.g. MP3356DG–Z).
For RoHS Compliant Packaging, add suffix –LF (e.g. MP3356DG–LF–Z)
PACKAGE REFERENCE
TOP VIEW
IGBTIN
IGBTOUT
SW
PG
1
2
3
4
VIN
AGND
PGND
EN
9
8
7
6
VIN
FB
5
10
ABSOLUTE MAXIMUM RATINGS
(1)
VIN to AGND.......................................-0.3Vto 6V
EN, IGBTIN, IGBTOUT, PG to AGND-0.3Vto 6V
FB to AGND...................................-60V to 350V
SW to AGND...................................-0.3V to 50V
PGND to AGND ……………………-0.3V to 0.3V
Storage Temperature............... -55
°C to +150°C
Continuous Power Dissipation (TA = +25°C)
(2)
…………………………………………..…....1.6W
Junction Temperature............................ +150
°C
Lead Temperature (Solder).....................+260
°C
Recommended Operating Conditions
(3)
Supply Voltage VIN .............................2.8V to 6V
Operating Junct. Temp (TJ)..... –40°C to +125°C
Thermal Resistance
(4)
θJA
θJC
2x2 Flip Chip ...........................80 ...... 16 ...
°C/W
Notes:
1) Exceeding these ratings may damage the device.
2)
The maximum allowable power dissipation is a function of the
maximum junction temperature TJ (MAX), the junction-to-
ambient thermal resistance θJA, and the ambient temperature
TA. The maximum allowable continuous power dissipation at
any ambient temperature is calculated by PD (MAX) = (TJ
(MAX)-TA)/θJA. Exceeding the maximum allowable power
dissipation will cause excessive die temperature, and the
regulator will go into thermal shutdown. Internal thermal
shutdown circuitry protects the device from permanent
damage.
3) The device is not guaranteed to function outside of its operating
conditions.
4) Measured on JESD51-7, 4-layer PCB.



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