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SD3112-4R7-R Datasheet(PDF) 15 Page - Skyworks Solutions Inc. |
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SD3112-4R7-R Datasheet(HTML) 15 Page - Skyworks Solutions Inc. |
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15 / 22 page ![]() 15 Skyworks Solutions, Inc. • Phone [781] 376-3000 • Fax [781] 376-3100 • sales@skyworksinc.com • www.skyworksinc.com 201999B • Skyworks Proprietary Information • Products and Product Information are Subject to Change Without Notice. • March 20, 2013 AAT1171 600mA Voltage-Scaling Step-Down Converter for RF Power Amplifiers with Bypass Switch DATA SHEET The input capacitor provides a low impedance loop for the edges of pulsed current drawn by the AAT1171. Low ESR/ESL X7R and X5R ceramic capacitors are ideal for this function. To minimize stray inductance, the capaci- tor should be placed as closely as possible to the IC. This keeps the high frequency content of the input current localized, minimizing EMI and input voltage ripple. The proper placement of the input capacitor (C1) can be seen in the evaluation board layout in Figure 4. A laboratory test set-up typically consists of two long wires running from the bench power supply to the eval- uation board input voltage pins. The inductance of these wires, along with the low-ESR ceramic input capacitor, can create a high Q network that may affect converter performance. This problem often becomes apparent in the form of excessive ringing in the output voltage dur- ing load transients with errors in loop phase and gain measurements. Since the inductance of a short PCB trace feeding the input voltage is significantly lower than the power leads from the bench power supply, most applications do not exhibit this problem. In applications where the input power source lead induc- tance cannot be reduced to a level that does not affect the converter performance, a high ESR tantalum or alu- minum electrolytic capacitor (C3 of Figure 5) should be placed in parallel with the low ESR, ESL bypass ceramic capacitor. This dampens the high Q network and stabi- lizes the system. DAC Programming Gain The output voltage is dynamically controlled by the DAC input voltage. The DAC to output gain is fixed at 3. The typical response time for a 0.2V to 1.2V pulsed signal on the DAC input is less than 30μs. The DAC gain can be reduced by an external resistive divider at the DAC input, as shown in the evaluation board schematic in Figures 2 and 3. For a DAC to output gain of 2 and R2 at 10kΩ, R1 is 4.99kΩ. (3- GDAC)R2 GDAC (3 - 2)10kΩ 2 R1 = = = 4.99kΩ Thermal Calculations There are three types of losses associated with the AAT1171 step-down converter: switching losses, con- duction losses, and quiescent current losses. Conduction losses are associated with the RDS(ON) characteristics of the power MOSFET devices. Switching losses are domi- nated by the gate charge of the power MOSFET devices. The AAT1171 main and synchronous power MOSFETs are sized to have similar RDS(ON) values that track with the input voltage. At full load, assuming continuous conduc- tion mode (CCM), a simplified form of the step-down converter losses is given by: PTOTAL = IO2 · RDS(ON) + (tSW · FS · IO + IQ) · VIN IQ is the step-down converter quiescent current. The term tsw is used to estimate the full load switching loss- es, which are dominated by the gate charge losses. For the condition where the buck converter is at 100% duty cycle dropout, the total device dissipation reduces to: PTOTAL = IO2 · RDS(ON) + IQ · VIN In bypass mode, the bypass MOSFET RDS(ON)(bp) is used to determine the losses. The power MOSFET RDS(ON) increas- es with decreasing input voltage and the associated losses are a maximum at the minimum input voltage (2.7V). PTOTAL = IO2 · RDS(ON)(bp) + IQ · VIN Since the RDS(ON), quiescent current, and switching losses all vary with input voltage, the total losses should be investigated over the complete input voltage range. After calculating the total losses, the maximum junction temperature can be derived from the θJA for the TDFN33- 12 package which is typically 50°C/W. TJ(MAX) = PTOTAL · ΘJA + TAMB |
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