1/13/98

Am29F010 Known Good Die

7

S U PPL EM EN T

PHYSICAL SPECIFICATIONS

Die dimensions . . . . . . . . . . . . . . 174 mils x 189 mils

4.42 mm x 4.80 mm

Die Thickness . . . . . . . . . . . . . ~20 mils or ~0.51 mm

Bond Pad Size . . . . . . . . . . . . . . 4.47 mils x 4.47 mils

113.48

µm x 113.48 µm

12,878

Pads Per Die . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .30

Bond Pad Metalization . . . . . . . . . . . . . . . . . . Al/Si/Cu

Die Backside . . . . . . . . . . . . . . . . . . . . . . . . No metal,

may be grounded (optional)

Passivation. . . . . . . . . . . . . . . . . . Nitride/SOG/Nitride

DC OPERATING CONDITIONS

Operating Temperature . . . Commercial 0

°C to +70°C

Industrial –40

°C to +85°C

Extended –55

°C to +125°C

MANUFACTURING INFORMATION

Manufacturing and Test. . . . . . . . . Fab 14, Austin, TX

Manufacturing ID. . . . . . . . . . . . . . . . . . . . . . 98108AK

Preparation for Shipment . . . . . . . . Penang, Malaysia

Fabrication Process . . . . . . . . . . . . . . . . . CS19AFDS

Die Revision . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 1

SPECIAL HANDLING INSTRUCTIONS

Processing

Do not expose KGD products to ultraviolet light or

process them at temperatures greater than 250

°C.

Failure to adhere to these handling instructions will

result in irreparable damage to the devices. For best

yield, AMD recommends assembly in a Class 10K

clean room with 30% to 60% relative humidity.

Storage

Store at a maximum temperature of 30

°C in a nitrogen-

purged cabinet or vacuum-sealed bag. Observe all

standard ESD handling procedures.