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AM79761 Datasheet(PDF) 19 Page - Advanced Micro Devices

Part # AM79761
Description  Physical Layer 10-Bit Transceiver for Gigabit Ethernet (GigaPHY??SD)
PDF  20 Pages
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Manufacturer  AMD [Advanced Micro Devices]
Direct Link  http://www.amd.com
Logo AMD - Advanced Micro Devices

AM79761 Datasheet(HTML) 19 Page - Advanced Micro Devices

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Am79761
19
PRELIMINARY
THERMAL CONSIDERATIONS
The Am79761 is packaged in a 14-mm or a 10-mm
conventional PQFP with an internal heat spreader. These
packages use an industry-standard EIAJ footprint, but
have been enhanced to improve thermal dissipation. The
construction of the packages are as shown in Figure 26.
Figure 26.
Package Cross Section
Table 24.
Thermal Resistance
The Am79761 is designed to operate with a junction
temperature up to 105oC. The user must guarantee
that the temperature specification is not violated. With
the Thermal Resistances shown above, the 10x10
PQFP can operate in still air ambient temperatures of
50oC, while the 14x14 PQFP can operate in still air am-
bient temperatures of 72oC. If the ambient air tempera-
ture exceeds these limits then some form of cooling
through a heatsink or an increase in airflow must be
provided.
Notes:
1. 50oC=110oC-1W*(10oC/W+50.8oC/W)
2. 72oC=110oC-1W*(95oC/W+29oC/W)
Symbol
Description
10 mm Value
14 mm Value
Units
θ
jc
Thermal resistance from junction to case
10.0
9.5
oC/W
θ
ca
Thermal resistance from case to ambient in still air including
conduction through the leads.
50.8
29
oC/W
θ
ca-100
Thermal resistance from case to ambient with 100 LFM airflow
41.2
26.1
oC/W
θ
ca-200
Thermal resistance from case to ambient with 200 LFM airflow
36.9
23.8
oC/W
θ
ca-400
Thermal resistance from case to ambient with 400 LFM airflow
31.8
20.5
oC/W
θ
ca-600
Thermal resistance from case to ambient with 600 LFM airflow
27.8
17.9
oC/W
Copper Heat Spreader
Plastic Molding Compound
Lead
Bond Wire
Die
21560A-12



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