W25X05CLZPIG datasheet(43/51 Pages) WINBOND

Part #	W25X05CLZPIG

Description	2.5 / 3 / 3.3 V 512K / 1M / 2M-BIT SERIAL FLASH MEMORY WITH 4KB SECTORS AND DUAL I/O SPI

PDF	51 Pages

Scroll/Zoom	100%

Manufacturer	WINBOND [Winbond]

Direct Link	http://www.winbond.com

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43 / 51 page

W25X05CL/10CL/20CL

Publication Release Date: March 23, 2012

- 43 -

Revision B

10. PACKAGE SPECIFICATION

10.1 8-Pin SOIC 150-mil (Package Code SN)

SYMBOL

MILLIMETERS

INCHES

Min

Max

Min

Max

1.35

1.75

0.053

0.069

0.10

0.25

0.004

0.010

0.33

0.51

0.013

0.020

0.19

0.25

0.008

0.010

E(3)

3.80

4.00

0.150

0.157

D(3)

4.80

5.00

0.188

0.196

e(2)

1.27 BSC

0.050 BSC

5.80

6.20

0.228

0.244

Y(4)

0.10

0.004

0.40

1.27

0.016

0.050

∘

0°

10°

0°

10°

Notes:

Controlling dimensions: millimeters, unless otherwise specified.

BSC = Basic lead spacing between centers.

Dimensions D and E do not include mold flash protrusions and should be measured from the bottom of the package.

Formed leads coplanarity with respect to seating plane shall be within 0.004 inches

SEATING PLANE

0.25

GAUGE PLANE

SEATING PLANE

0.25

GAUGE PLANE

W25X05CLZPIG Datasheet(PDF) 43 Page - Winbond

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