PIC24FJ128GA310 datasheet(360/406 Pages) MICROCHIP

360 / 406 page

PIC24FJ128GA310 FAMILY

DS39996F-page 360

 2010-2011 Microchip Technology Inc.

32.1

DC Characteristics

FIGURE 32-1:

PIC24FJ128GA310 FAMILY VOLTAGE-FREQUENCY GRAPH (INDUSTRIAL)

TABLE 32-1:

THERMAL OPERATING CONDITIONS

Rating

Symbol

Min

Typ

Max

Unit

PIC24FJ128GA310 family:

Operating Junction Temperature Range

-40

—

+125

°C

Operating Ambient Temperature Range

-40

—

+85

°C

Power Dissipation:

Internal Chip Power Dissipation: PINT = VDD x (IDD –

 IOH)

PINT + PI/O

I/O Pin Power Dissipation:

PI/O =

 ({VDD – VOH} x IOH) +  (VOL x IOL)

Maximum Allowed Power Dissipation

PDMAX

(TJMAX – TA)/

JA

Frequency

2.0V

32 MHz

3.6V

2.0V

2.2V

Note:

VCAP (nominal On-Chip Regulator output voltage) = 1.8V.

PIC24FJXXXDA1

TABLE 32-2:

THERMAL PACKAGING CHARACTERISTICS

Characteristic

Symbol

Typ

Max

Unit

Note

Package Thermal Resistance, 14x14x1 mm 100-pin TQFP

JA

43.0

—

°C/W

(Note 1)

Package Thermal Resistance, 12x12x1 mm 100-pin TQFP

JA

45.0

—

°C/W

(Note 1)

Package Thermal Resistance, 12x12x1 mm 80-pin TQFP

JA

48.0

—

°C/W

(Note 1)

Package Thermal Resistance, 10x10x1 mm 64-pin TQFP

JA

48.3

—

°C/W

(Note 1)

Package Thermal Resistance, 9x9x0.9 mm 64-pin QFN

JA

28.0

—

°C/W

(Note 1)

Package Thermal Resistance, 10x10x1.1 mm 121-pin BGA

JA

40.2

—

°C/W

(Note 1)

Note 1:

Junction to ambient thermal resistance, Theta-JA (

JA) numbers are achieved by package simulations.

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