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ASM0406C Datasheet(PDF) 6 Page - Aplus Intergrated Circuits |
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ASM0406C Datasheet(HTML) 6 Page - Aplus Intergrated Circuits |
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6 / 7 page ![]() 1.4 Bonding Diagram ASM0406C 16K x 10 bit ROM 6 7 8 9 5 4 1 2 3 10 11 CHIP SIZE: X= 1550+80(um) , Y= 1360+80(um) Substrate must be connected to GND. ASM0406C Pad Location Chip Size: X= 1550 + 80 (um), Y=1360 + 80 (um) PAD # PAD Name X Y PAD # PAD Name X Y 1 RA3 -664.92 -275.52 7 TEST 105.44 -600.2 2 RA2 -664.92 -403.64 8 COUT 303.96 -600.2 3 RA1 -662.64 -600.2 9 VDD 683.04 -600.2 4 RA0 -468.24 -600.2 10 RB0 664.92 -399.2 5 OSC -281.04 -600.2 11 RB1 664.92 -280.8 6 GND -111.72 -600.2 5 ASM0406C X= 1550+80(um) Y= 1360+80(um) |
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