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AS1322

Datasheet - A p p l i c a t i o n I n f o r m a t i o n

9.3 PCB Layout Guidelines

The high-speed operation of the AS1322 requires proper layout for optimum performance. Figure 23 shows the recommended component

layout.

A large ground pin copper area will help to lower the device temperature.

A multi-layer board with a separate ground plane is recommended.

Traces carrying large currents should be direct.

Trace area at pin FB should be as small as is practical.

The lead-length to the battery should be as short as is practical.

Figure 23. Recommended Single-Layer Component Placement

1

AS1322

2

3

6

5

4

Optional

SHDNN

FB

GND

SW

SHDNN