TSL4531

DIGITAL AMBIENT LIGHT SENSOR

TAOS112

A − OCTOBER 2012

12

r

r

Copyright

E 2012, TAOS Inc.

The LUMENOLOGY

r Company

www.taosinc.com

PACKAGE INFORMATION

PACKAGE CL

ChipLED

0.60

0.30

0.15

1.35

0.7

+ 0.1

1.2

Pb

TOP VIEW

END VIEW

BOTTOM VIEW

PIN OUT

TOP VIEW

4 SCL

3 SDA

GND 2

2.0

+ 0.1

Pin 1

(Note E)

Pin 1

0.3 Min

2.0

+ 0.1

Photodiode Array Area

0.10

0.45

0.277 Nominal

0.277

Nominal

Array Area (Note B)

Array Area (Note B)

NOTES: A. All linear dimensions are in millimeters.

B. The die is offset within the package to center the photodiode array to the solder contacts within a tolerance of

± 50 μm.

C. Package top surface is molded with an electrically nonconductive yellow clear plastic compound having an index of refraction

of 1.55.

D. Contact finish is copper alloy A194 with pre-plated NiPdAu lead finish.

E. Bottom pin 1 indicator is electrically connected to pin 1.

F. This package contains no lead (Pb).

G. This drawing is subject to change without notice.

Figure 9. Package CL — ChipLED Packaging Configuration