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dsPIC33FJ32MC302 Datasheet(PDF) 18 Page - Microchip Technology

Part # dsPIC33FJ32MC302
Description  16-bit Digital Signal Controllers (up to 128 KB Flash and 16K SRAM) with Motor Control PWM and Advanced Analog
PDF  460 Pages
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Manufacturer  MICROCHIP [Microchip Technology]
Direct Link  http://www.microchip.com
Logo MICROCHIP - Microchip Technology

dsPIC33FJ32MC302 Datasheet(HTML) 18 Page - Microchip Technology

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dsPIC33FJ32MC302/304, dsPIC33FJ64MCX02/X04 AND dsPIC33FJ128MCX02/X04
DS70291G-page 18
© 2007-2012 Microchip Technology Inc.
FIGURE 2-1:
RECOMMENDED
MINIMUM CONNECTION
2.2.1
TANK CAPACITORS
On boards with power traces running longer than six
inches in length, it is suggested to use a tank capacitor
for integrated circuits including DSCs to supply a local
power source. The value of the tank capacitor should
be determined based on the trace resistance that
connects the power supply source to the device, and
the maximum current drawn by the device in the
application. In other words, select the tank capacitor so
that it meets the acceptable voltage sag at the device.
Typical values range from 4.7 µF to 47 µF.
2.3
CPU Logic Filter Capacitor
Connection (VCAP)
A low-ESR (< 5 Ohms) capacitor is required on the
VCAP pin, which is used to stabilize the voltage
regulator output voltage. The VCAP pin must not be
connected to VDD, and must have a capacitor between
4.7 µF and 10 µF, preferably surface mount connected
within one-eights inch of the VCAP pin connected to
ground. The type can be ceramic or tantalum. Refer to
Section 31.0
“Electrical
Characteristics”
for
additional information.
The placement of this capacitor should be close to the
VCAP. It is recommended that the trace length not
exceed one-quarter inch (6 mm). Refer to Section 28.2
“On-Chip Voltage Regulator” for details.
2.4
Master Clear (MCLR) Pin
The MCLR pin provides for two specific device
functions:
• Device Reset
• Device programming and debugging
During device programming and debugging, the
resistance and capacitance that can be added to the
pin must be considered. Device programmers and
debuggers drive the MCLR pin. Consequently,
specific voltage levels (VIH and VIL) and fast signal
transitions must not be adversely affected. Therefore,
specific values of R and C will need to be adjusted
based on the application and PCB requirements.
For example, as shown in Figure 2-2, it is
recommended that the capacitor C be isolated from the
MCLR pin during programming and debugging
operations.
Place the components shown in Figure 2-2 within
one-quarter inch (6 mm) from the MCLR pin.
FIGURE 2-2:
EXAMPLE OF MCLR PIN
CONNECTIONS
dsPIC33F
VDD
VSS
VSS
VDD
0.1 µF
Ceramic
0.1 µF
Ceramic
0.1 µF
Ceramic
0.1 µF
Ceramic
C
R
VDD
MCLR
0.1 µF
Ceramic
L1(1)
R1
10 µF
Tantalum
Note 1:
As an option, instead of a hard-wired connection, an
inductor (L1) can be substituted between VDD and
AVDD to improve ADC noise rejection. The inductor
impedance should be less than 1
Ω and the inductor
capacity greater than 10 mA.
Where:
f
FCNV
2
--------------
=
f
1
2
π LC
()
-----------------------
=
L
1
2
πfC
()
---------------------
⎝⎠
⎛⎞
2
=
(i.e., ADC conversion rate/2)
Note 1: R
≤ 10 kΩ is recommended. A suggested
starting value is 10 k
Ω. Ensure that the MCLR
pin VIH and VIL specifications are met.
2: R1
≤ 470Ω will limit any current flowing into
MCLR from the external capacitor C, in the
event of MCLR pin breakdown due to
Electrostatic Discharge (ESD) or Electrical
Overstress (EOS). Ensure that the MCLR pin
VIH and VIL specifications are met.
C
R1(2)
R(1)
VDD
MCLR
dsPIC33F
JP



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