DYNAMIC CHARACTERISTICS

APT60S20B_S(G)

THERMAL AND MECHANICAL CHARACTERISTICS

Microsemi reserves the right to change, without notice, the specifications and information contained herein.

Characteristic / Test Conditions

Junction-to-Case Thermal Resistance

Junction-to-Ambient Thermal Resistance

Package Weight

Maximum Mounting Torque

Symbol

R

θJC

R

θJA

W

T

Torque

MIN

TYP

MAX

.30

40

0.22

5.9

10

1.1

UNIT

°C/W

oz

g

lb•in

N•m

MIN

TYP

MAX

-

55

-

160

-5

-

-

100

-

490

-10

-

-80

-

1100

-27

UNIT

ns

nC

Amps

ns

nC

Amps

ns

nC

Amps

Characteristic

Reverse Recovery Time

Reverse Recovery Charge

Maximum Reverse Recovery Current

Reverse Recovery Time

Reverse Recovery Charge

Maximum Reverse Recovery Current

Reverse Recovery Time

Reverse Recovery Charge

Maximum Reverse Recovery Current

Symbol

t

rr

Q

rr

I

RRM

t

rr

Q

rr

I

RRM

t

rr

Q

rr

I

RRM

Test Conditions

I

V

I

V

I

V

1.0

RECTANGULAR PULSE DURATION (seconds)

FIGURE 1a. MAXIMUM EFFECTIVE TRANSIENT THERMAL IMPEDANCE, JUNCTION-TO-CASE vs. PULSE DURATION

0.35

0.30

0.25

0.20

0.15

0.10

0.05

0

Note:

Duty Factor D = t1/t2

Peak TJ = PDM x ZθJC + TC

t1

t2

SINGLE PULSE

0.1

0.3

0.7

D = 0.9

0.05

FIGURE 1b, TRANSIENT THERMAL IMPEDANCE MODEL

0.5

0.0218

0.119

0.160

0.00450

0.0119

0.121

Dissipated Power

(Watts)

T

T

Z

impedances: Case to sink,

sink to ambient, etc. Set to

zero when modeling only

the case to junction.