BAS21C2 datasheet(2/6 Pages) CYSTEKEC

2 / 6 page

CYStech Electronics Corp.

Spec. No. : C335C2

Issued Date : 2013.02.05

Revised Date :

Page No. : 2/6

BAS21C2

CYStek Product Specification

Absolute Maximum Ratings (TA=25℃, unless otherwise noted)

Parameters

Conditions

Symbol Min

Typ

Max Units

Repetitive peak reverse voltage

VRRM

300

RMS voltage

VRMS

210

Continuous reverse voltage

300

Continuous forward current

250

Repetitive peak forward current

tp=1ms, duty≤0.25

IFRM

Non-repetitive peak forward current

t=1μs

IFSM

4.5

TA=25°C

(Note 1)

250

Total Device Dissipation

TSP≤90°C

(Note 2)

500

Junction to ambient

(Note 1)

RθJA

500

Thermal resistance

Junction to soldering point (Note3)

RθJSP

120

°C/W

Storage temperature range

Tstg

-65

150

°C

Operating junction temperature range

-55

150

°C

Note :1.Parts mounted on FR-5 board with minimum pad, in free air.

2.Tsp is the solder point temperature at the soldering point of the cathode tab.

3.Soldering point of cathode tab.

Characteristics (Ta=25°C)

Characteristic

Symbol

Condition

Min.

Max.

Unit

Reverse Breakdown Voltage

VBR

IR=100μA

300

VF(1)

IF=100mA

Forward Voltage (Note)

VF(2)

IF=200mA

1.25

IR(1)

VR=250V,Tj=25℃

150

Reverse Leakage Current (Note)

IR(2)

VR=250V,Tj=150℃

100

μA

Diode Capacitance

VR=0V, f=1MHz

Reverse Recovery Time

trr

IF=IR=30mA RL=100

measured at IR=3mA

Notes

: Pulse test, tp=300μs, duty cycle<2%.

Ordering Information

Device

Package

Shipping

BAS21C2-0-T5-G

SOD-523

(Pb-free lead plating and halogen-free package)

8000 pcs / Tape & Reel

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