Phone: +86-23-62808818

Fax: +86-23-62805284

www.sipatsaw.com / sawmkt@sipat.com

Part Number

SP43303

Rev. Date

2006-7-19

SIPAT Co., Ltd.

( CETC No. 26 Research Institute )

Nanping Huayuan Road No. 14

Chongqing, China, 400060

Rev.

1.0

Page 4/8

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433.92MHz RF SAW Filter

1.7MHz Bandwidth

Part Number: SP43303

4. Reliability

4.1 Mechanical Shock: The components shall remain within the electrical specifications after

three one-half sine shock pulses(3000g’s for 0.3 ms) in each direction(for six total) along

each of the three mutually perpendicular axes for a total of 18 shocks.

4.2 Vibration Fatigue: The components shall remain within the electrical specifications after

loaded vibration at 20~55Hz, amplitude 1.5mm, X,Y,Z, direction, for 2 hours.

4.3 Leak Test

4.3.1 Gross Leak Test: Submerge samples into at +85

water for at least 1 minute. Carefully

℃

observe the

samples. No bubbles should be seen.

4.3.2 Fine Leak Test: Expose samples for testing to 60 PSIG Helium gas for 2 hours. Then

transfer the same

samples to another chamber and draw a vacuum. Measure the leak rate. Failure is defined

if the leak rate

exceeds 5×10

4.4 High Temperature Storage: The components shall remain within the electrical

specifications after being kept at the 85 ±2 for 960 hours, then kept at room

℃℃

temperature for 2 hours.

4.5 Low Temperature Storage: The components shall remain within the electrical specifications

after being kept at the –40 ±2 for 960 hours, then kept at room temperature for 2 hours.

℃℃

4.6 Temperature Cycle: The components shall remain within the electrical specification after

32 cycles of high and low temperature testing (one cycle: 80

for 30 minutes → 25

for

℃℃

20 seconds → -40

for 30 minutes) than kept at room temperature for 2 hours.

℃

4.7 Humidity Test: The components shall remain within the electrical specifications after being

kept at the condition of ambient temperature 70 , and 90~95% RH for 240 hours, then

℃

kept at room temperature and normal humidity for 4 hours.

4.8 Solder-heat Resistance: The components shall remain within the electrical specifications

after dipped in the solder at 260 ±5

for 10 to 11 seconds, then kept at room

℃℃

temperature for 10 minutes.

4.9 Solderability: Solderability of terminal shall be kept at more than 80% after dipped in the

solder flux at 230 ±5

for 5±1 seconds.

℃℃

4.10 Storage: The components shall meet the electrical and mechanical specifications after 5

years storage, if stored within the temperature range of -40 ~+85

and in the humidity of

℃℃

20 to 60% r.h.