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DMHC3025LSD Datasheet(PDF) 3 Page - Diodes Incorporated

Part # DMHC3025LSD
Description  30V COMPLEMENTARY ENHANCEMENT MODE MOSFET H-BRIDGE
PDF  9 Pages
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Manufacturer  DIODES [Diodes Incorporated]
Direct Link  http://www.diodes.com
Logo DIODES - Diodes Incorporated

DMHC3025LSD Datasheet(HTML) 3 Page - Diodes Incorporated

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DMHC3025LSD
Document number: DS35821 Rev. 4 - 2
3 of 9
www.diodes.com
November 2013
© Diodes Incorporated
DMHC3025LSD
Electrical Characteristics N-CHANNEL (@TA = +25°C, unless otherwise specified.)
Characteristic
Symbol
Min
Typ
Max
Unit
Test Condition
OFF CHARACTERISTICS (Note 6)
Drain-Source Breakdown Voltage
BVDSS
30
—
—
V
VGS = 0V, ID = 250μA
Zero Gate Voltage Drain Current
IDSS
—
—
0.5
μA
VDS = 30V, VGS = 0V
Gate-Source Leakage
IGSS
—
—
±1
μA
VGS = ±20V, VDS = 0V
ON CHARACTERISTICS (Note 6)
Gate Threshold Voltage
VGS(th)
1
—
2
V
VDS = VGS, ID = 250μA
Static Drain-Source On-Resistance
RDS (ON)
—
19
25
mΩ
VGS = 10V, ID = 5A
—
26
40
VGS = 4.5V, ID = 4A
Forward Transfer Admittance
|Yfs|
—
4
—
S
VDS = 5V, ID = 5A
Diode Forward Voltage
VSD
—
0.70
1.2
V
VGS = 0V, IS = 1.7A
DYNAMIC CHARACTERISTICS (Note 7)
Input Capacitance
Ciss
—
590
—
pF
VDS = 15V, VGS = 0V,
f = 1MHz
Output Capacitance
Coss
—
122
—
Reverse Transfer Capacitance
Crss
—
58
—
Gate resistance
Rg
—
1.5
—
Ω
VDS = 0V, VGS = 0V, f = 1MHz
Total Gate Charge (VGS = 4.5V)
Qg
—
5.4
—
nC
VDS = 15V, ID = 7.8A
Total Gate Charge (VGS = 10V)
Qg
—
11.7
—
Gate-Source Charge
Qgs
—
1.8
—
Gate-Drain Charge
Qgd
—
2.1
—
Turn-On Delay Time
tD(on)
—
11.2
—
ns
VDD = 15V, VGS = 4.5V,
RL = 2.4Ω, RG = 1Ω,
Turn-On Rise Time
tr
—
15
—
Turn-Off Delay Time
tD(off)
—
17.5
—
Turn-Off Fall Time
tf
—
8.7
—
Reverse Recovery Time
trr
—
18.3
—
ns
IF = 12A, di/dt = 500A/μs
Reverse Recovery Charge
Qrr
—
12
—
nC
Electrical Characteristics P-CHANNEL (@TA = +25°C, unless otherwise specified.)
Characteristic
Symbol
Min
Typ
Max
Unit
Test Condition
OFF CHARACTERISTICS (Note 6)
Drain-Source Breakdown Voltage
BVDSS
-30
—
—
V
VGS = 0V, ID = -250μA
Zero Gate Voltage Drain Current
IDSS
—
—
-0.5
μA
VDS = -30V, VGS = 0V
Gate-Source Leakage
IGSS
—
—
±1
μA
VGS = ±20V, VDS = 0V
ON CHARACTERISTICS (Note 6)
Gate Threshold Voltage
VGS(th)
-1
—
-2
V
VDS = VGS, ID = -250μA
Static Drain-Source On-Resistance
RDS (ON)
—
43
50
mΩ
VGS = -10V, ID = -5A
—
68
80
VGS = -4.5V, ID = -4A
Forward Transfer Admittance
|Yfs|
—
3.5
—
S
VDS = -5V, ID = -5A
Diode Forward Voltage
VSD
—
-0.7
-1.2
V
VGS = 0V, IS = -1.7A
DYNAMIC CHARACTERISTICS (Note 7)
Input Capacitance
Ciss
—
631
—
pF
VDS = -15V, VGS = 0V,
f = 1MHz
Output Capacitance
Coss
—
137
—
pF
Reverse Transfer Capacitance
Crss
—
70
—
pF
Gate resistance
Rg
—
10.8
—
Ω
VDS = 0V, VGS = 0V, f = 1MHz
Total Gate Charge (VGS = 4.5V)
Qg
—
5.5
—
nC
VDS = -15V, ID = -6A
Total Gate Charge (VGS = 10V)
Qg
—
11.4
—
nC
Gate-Source Charge
Qgs
—
1.8
—
nC
Gate-Drain Charge
Qgd
—
2.4
—
nC
Turn-On Delay Time
tD(on)
—
7.5
—
ns
VDD = -15V, VGS = -10V,
RG = 6Ω, ID = -1A
Turn-On Rise Time
tr
—
4.9
—
ns
Turn-Off Delay Time
tD(off)
—
28.2
—
ns
Turn-Off Fall Time
tf
—
13.5
—
ns
Reverse Recovery Time
trr
—
15.1
—
ns
IF = 12A, di/dt = 500A/μs
Reverse Recovery Charge
Qrr
—
15.3
—
nC
Notes:
6. Short duration pulse test used to minimize self-heating effect.
7. Guaranteed by design. Not subject to product testing.



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