• North America Tel: 800.366.2266 / Fax: 978.366.2266

• Europe Tel: 44.1908.574.200 / Fax: 44.1908.574.300

• Asia/Pacific Tel: 81.44.844.8296 / Fax: 81.44.844.8298

Visit www.macomtech.com for additional data sheets and product information.

M/A-COM Technology Solutions Inc. and its affiliates reserve the right to make

changes to the product(s) or information contained herein without notice.

1

Silicon Doubled Balanced HMIC Mixer

700 - 1200 MHz

Rev. V3

MAMX-000950-1225MT

ADVANCED: Data Sheets contain information regarding a product M/A-COM Technology Solutions

is considering for development. Performance is based on target specifications, simulated results,

and/or prototype measurements. Commitment to develop is not guaranteed.

PRELIMINARY: Data Sheets contain information regarding a product M/A-COM Technology

Solutions has under development. Performance is based on engineering tests. Specifications are

typical. Mechanical outline has been fixed. Engineering samples and/or test data may be available.

Commitment to produce in volume is not guaranteed.

Features

 SOT-25 Low Cost Miniature Plastic Package

 7.0 dB Typical Conversion Loss

 +7 to +13 dBm LO Drive

 HMIC Patented Process

 Silicon Medium Barrier Schottky Diodes

 DC - 400 MHz IF Bandwidth

 RoHS* Compliant with 260 °C Reflow Capability

 100% Matte Tin Plating

Description and Applications

M/A-COM’s MAMX-000950-1225MT is a 700-1200 MHz

silicon monolithic double balanced mixer in a low cost

miniature surface mount SOT-25 package. The die uses

M/A-COM’s unique HMIC silicon/glass process to

achieve low loss passive elements while retaining

the advantages of medium barrier silicon Schottky

barrier diodes.

These mixers are well suited for high volume wire-

less and cellular applications where small size and

repeatability are required.

Typical applications

include

frequency

conversion,

modulation,

and

demodulation in wireless receivers and transmitters.

SOT-25 Package Outline

(Topview)

Absolute Maximum Ratings

1,2

Parameter

Maximum Ratings

Operating Temperature

-65 °C to +125 °C

Storage Temperature

-65 °C to +150 °C

Incident LO Power

+20 dBm

Incident RF Power

+20 dBm

Soldering Temperature

+260 °C max.

1. Exceeding these limits may cause permanent damage.

2. Please refer to application note M538 for surface mounting

instructions.

LO

IF

RF

Schematic

PIN Configuration

PIN

Function

PIN

Function

1

RF

4

GND

2

GND

5

IF

3

LO

2

3

1

4

5

* Restrictions on Hazardous Substances, European Union Directive 2002/95/EC.