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STM1831 Datasheet(PDF) 17 Page - STMicroelectronics |
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STM1831 Datasheet(HTML) 17 Page - STMicroelectronics |
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17 / 24 page ![]() STM1831 Maximum ratings Doc ID 18180 Rev 1 17/24 4 Maximum ratings Stressing the device above the ratings listed in Table 2 may cause permanent damage to the device. These are stress ratings only and operation of the device at these or any other conditions above those indicated in the operating sections of this specification is not implied. Exposure to absolute maximum rating conditions for extended periods may affect device reliability. Table 2. Absolute maximum ratings Symbol Parameter Value Unit TSTG Storage temperature (VCC off) –55 to 150 °C TSLD (1) 1. Reflow at peak temperature of 260 °C. The time above 255 °C must not exceed 30 seconds. Lead solder temperature for 10 seconds 260 °C TJ Maximum junction temperature 125 °C VCC Supply voltage –0.3 to 7.0 V VCD Delay capacitor pin voltage –0.3 to VCC + 0.3 V VRST Reset output voltage – N-channel open drain –0.3 to 7.0 V VESD ESD voltage – Human body model (MIL-STD-883, Method 3015) – Machine model 2000 200 V |
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