4

Low Noise GaAs MMIC Amplifier

3.5 - 7.0 GHz

Rev. V7

MAAM37000

• North America Tel: 800.366.2266 • Europe Tel: +353.21.244.6400

• India Tel: +91.80.43537383

• China Tel: +86.21.2407.1588

Visit www.macomtech.com for additional data sheets and product information.

M/A-COM Technology Solutions Inc. and its affiliates reserve the right to make

changes to the product(s) or information contained herein without notice.

ADVANCED: Data Sheets contain information regarding a product M/A-COM Technology Solutions

is considering for development. Performance is based on target specifications, simulated results,

and/or prototype measurements. Commitment to develop is not guaranteed.

PRELIMINARY: Data Sheets contain information regarding a product M/A-COM Technology

Solutions has under development. Performance is based on engineering tests. Specifications are

typical. Mechanical outline has been fixed. Engineering samples and/or test data may be available.

Commitment to produce in volume is not guaranteed.

Handling Procedures

Permanent damage to the MAAM37000 may occur

if the following precautions are not adhered to:

A. Cleanliness - The MAAM37000 should be han-

dled in a clean environment. DO NOT attempt

to clean assembly after the MAAM37000 is

installed.

B. Static Sensitivity - All die handling equipment

and personnel should comply with DOD-STD-

1686 Class I.

C. Transients - Avoid instrument and power sup-

ply transients while bias is connected to the

MAAM37000. Use shielded signal and bias

cables to minimize inductive pick-up.

D. General Handling - DO NOT touch the surface

of the die.

It is recommended that the

MAAM37000 die be handled along the long

side with a sharp pair of tweezers.

Mounting

The MAAM37000 is back-metallized with Pd/Ni/Au

(100/1, 000/30,000Å) metallization. It can be die-

mounted using Au/Sn eutectic preforms or a ther-

mally and electrically conductive epoxy. The at-

tachment surface should be clean and flat.

Eutectic Die Attach:

A. An 80/20 Au/Sn preform is recommended with

a work surface temperature of approximately

255°C and a tool temperature of 265°C. When

hot 95/5 nitrogen/hydrogen gas is applied, sol-

der temperature should be approximately 290°

C.

B. DO NOT expose the MAAM37000 to a tem-

perature greater than 320°C for more than 20

seconds. No more than 3 seconds of scrub-

bing should be required for attachment.

Epoxy Die Attach:

A. Electrically conductive epoxy is required.

B. Apply a minimum amount of epoxy and place

the MAAM37000 into position. A thin epoxy

fillet should be visible around the perimeter of

the die.

C.

Cure epoxy per manufacturer’s recommended

schedule.

Bonding

A. Ball or wedge bond with 1.0 mil diameter gold

wire of 3.0 mil x 0.5 mil ribbon. Thermosonic

bonding with a nominal stage temperature of

150°C and a ball bonding force of 40 to 50

grams or wedge bonding force of 18 to 22

grams is recommended. Ultrasonic energy and

time should be adjusted to the minimum levels

necessary to achieve reliable bonds.

B. Bonds should be started on the die and termi-

nated on the package.

C. Bonding pads are 4.0 x 4.0 mils minimum.