MA4SW424B-1

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Data Sheets contain information regarding a product M/A-COM Technology Solutions

is considering for development. Performance is based on target specifications, simulated results,

and/or prototype measurements. Commitment to develop is not guaranteed.

PRELIMINARY:

Data Sheets contain information regarding a product M/A-COM Technology

Solutions has under development. Performance is based on engineering tests. Specifications are

typical. Mechanical outline has been fixed. Engineering samples and/or test data may be available.

Commitment to produce in volume is not guaranteed.

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changes to the product(s) or information contained herein without notice.

5

SP4T 24GHz PIN Diode Switch with Integrated Bias Network

Rev. V1

Chip Dimensions

A

B

C

C

D

E

F

G

G

H

H

I

Dimension

Mils

Millimeters

Min

Max

Min

Max

A

100

104

2.54

2.64

B

131

135

3.33

3.43

C

61

62

1.55

1.57

D

27

28

0.70

0.72

E

64

65

1.63

1.65

F

91

92

2.31

2.33

G

25

26

0.63

0.65

H

52

52

1.31

1.33

I

19

20

0.48

0.50

Notes:

1. All RF (J) bond pads are 4.5 X 5.5 mils (0.177 X .217 mm).

2. All DC (B) bond pads are 4.0 X 5.5 mils (0.157 X .217 mm).

3. Chip thickness 5 mils (.127 mm)