PIN-HIPAX-SERIES datasheet(12/12 Pages) MA-COM

12 / 12 page

High Power PIN Diodes

V14

MA4P MELF & HIPAX™Series

ADVANCED: Data Sheets contain information regarding a product M/A-COM Technology Solutions

is considering for development. Performance is based on target specifications, simulated results,

and/or prototype measurements. Commitment to develop is not guaranteed.

PRELIMINARY: Data Sheets contain information regarding a product M/A-COM Technology

Solutions has under development. Performance is based on engineering tests. Specifications are

typical. Mechanical outline has been fixed. Engineering samples and/or test data may be available.

Commitment to produce in volume is not guaranteed.

• North America Tel: 800.366.2266 • Europe Tel: +353.21.244.6400

• India Tel: +91.80.4155721

• China Tel: +86.21.2407.1588

Visit www.macomtech.com for additional data sheets and product information.

M/A-COM Technology Solutions Inc. and its affiliates reserve the right to make

changes to the product(s) or information contained herein without notice.

HIPAX PIN diodes are designed to meet most environmental and electrical requirements and may be ordered

screened to MIL-STD-750 specifications as described in the table below.

TEST

METHOD

DESCRIPTION/ CONDITIONS

Moisture Resistance

1021

85°C, 85% Relative Humidity, 168 hrs

High Temperature Storage

1031

+175°C , 250 Hours

HTRB

1038

80% of rated VR, 50°C, 96 Hours

Temperature Shock

1051

-65°C to +175°C, 20 Cycles

Fine Leak

1071 Cond. H

1 X 10-7 CC/Sec

Constant Acceleration

2006

20,000 G’s

Solderability

2026

IPC/JDEC J-STD-02

Tension1

2036.3 Cond. A

2 Lbs., 30 Seconds

Lead Fatigue1

2036.3 Cond. E

3 Cycles, 8 oz., 90°,

Note:

1) Test applicable to HIPAX axially leaded devices only.

Environmental Ratings

.060” Min

Axial Leaded HIPAX Assembly Recommendations

♦ Bends on case styles 401 and 402, axially leaded devices, must be made while holding the lead firm and forming the

bend no closer than .060 inches from the body of the part. Bending the lead < 0.060 inches from the body of the part

is not recommended and may cause internal damage to the chip. Appropriate fixturing should be used.

♦ Devices may be soldered using standard 60Sn/40Pb or any RoHS compliant solders. Axial leads are tin plated 50

μm

thick to ensure an optimum connection.

♦ For recommended Sn/Pb and RoHS soldering profiles see page 7 of Application Note M538 on the M/A-COM Tech-

Case Style 401 & 402

Internal Construction

Case Style 401 & 402

Minimum Bend Distance

Package Style

Quantity Per Reel

Bulk Devices Per Bag

401T

500 or 1000 (specify qty. when ordering)

N/A

402

N/A

100

Ordering Information

Axial leaded diodes are available in tape and reel or bulk in quantities shown in the table below

Passivated Chip

Cathode Band

PIN-HIPAX-SERIES Datasheet(PDF) 12 Page - M/A-COM Technology Solutions, Inc.

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