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FMMT549 Datasheet(PDF) 2 Page - Diodes Incorporated |
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FMMT549 Datasheet(HTML) 2 Page - Diodes Incorporated |
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2 / 5 page ![]() FMMT549 / FMMT549A Document Number: DS33098 Rev. 4 - 2 2 of 5 www.diodes.com September 2011 © Diodes Incorporated A Product Line of Diodes Incorporated FMMT549 / FMMT549A Maximum Ratings @TA = 25°C unless otherwise specified Characteristic Symbol Value Unit Collector-Base Voltage VCBO -35 V Collector-Emitter Voltage VCEO -30 V Emitter-Base Voltage VEBO -5 V Continuous Collector Current IC -1 A Peak Pulse Current ICM -2 A Base Current IB -200 mA Thermal Characteristics @TA = 25°C unless otherwise specified Characteristic Symbol Value Unit Power Dissipation (Note 4) PD 500 mW Thermal Resistance, Junction to Ambient (Note 4) RθJA 250 °C/W Thermal Resistance, Junction to Lead (Note 5) RθJL 197 °C/W Operating and Storage Temperature Range TJ, TSTG -55 to +150 °C Electrical Characteristics @TA = 25°C unless otherwise specified Characteristic Symbol Min Typ Max Unit Test Condition Collector-Base Breakdown Voltage BVCBO -35 - - V IC = -100µA Collector-Emitter Breakdown Voltage (Note 6) BVCEO -30 - - V IC = -10mA Emitter-Base Breakdown Voltage BVEBO -5 - - V IE = -100µA Collector Cutoff Current ICBO - - -0.1 µA VCB = -30V - - -10 VCB = -30V, TA = 100°C Emitter Cutoff Current IEBO - - -0.1 µA VEB = -4V Static Forward Current Transfer Ratio (Note 6) hFE 70 200 - - IC = -50mA, VCE = -2V 80 130 - IC = -1A, VCE = -2V 40 80 - IC = -2A, VCE = -2V FMMT549 100 160 300 - IC = -500mA, VCE = -2V FMMT549A 150 200 500 - IC = -500mA, VCE = -2V Collector-Emitter Saturation Voltage VCE(sat) - -250 -500 mV IC = - 1A, IB = -100mA - -500 -750 IC = - 2A, IB = -200mA FMMT549A - - -300 mV IC = -100mA, IB = -1mA Base-Emitter Saturation Voltage (Note 6) VBE(sat) - -900 -1250 mV IC = -1A, IB = -100mA Base-Emitter Turn-On Voltage (Note 6) VBE(on) - -850 -1000 mV IC = -1A, VCE = -2V Output Capacitance Cobo - - 25 pF VCB = -10V, f = 1MHz Transition Frequency fT 100 - - MHz VCE = -5V, IC = -100mA, f = 100MHz Switching Times ton - 50 - ns IC = -500mA, VCC = -10V IB1 = IB2 = -50mA toff - 300 - ns Notes: 4. For a device surface mounted FR4 PCB with minimum recommended pad layout; high coverage of single sided 1 oz copper, in still air conditions; the device is measured when operating in a steady-state condition. 5. Thermal resistance from junction to solder-point (at the end of the collector lead). 6. Measured under pulsed conditions. Pulse width ≤ 300 µs. Duty cycle ≤ 2% |
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