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NIC COMPONENTS CORP. www.niccomp.com

www.lowESR.com

www.RFpassives.com

www.SMTmagnetics.com

®

Thin Film Chip Inductors

NTI Series

Case Size

0201

0402

0603

Inductance Range

0.1nH ~ 10nH

0.2nH ~ 33nH

1.0nH ~ 100nH

Available Tolerance

±0.1nH (B), ±0.2nH (C), ±0.3nH (D), ±1% (F), ±2% (G) & ±5% (J)

Temperature Range

-40°C ~ +85°C

Resistance to Solder Heat

260°C ±5°C for 5 seconds

Temperature Cycling

ΔL <10% after 10 cycles -40°C/+20°C/+85°C/+20°C

FEATURES

NTI 02

F 10N TR F

Pb-free/RoHS compliant

Tape & Reel Packaging

Inductance Value in nano-henries,

"N" indicates decimal point

Inductance Tolerance (see values tables)

Case Code

Series

PART NUMBER SYSTEM

• ULTRA-SMALL LOW PROFILE 0201, 0402 & 0603 SIZES

• HIGH CURRENT & HIGH SRF

• COMPATIBLE WITH Pb-FREE SOLDERING

• RoHS COMPLIANT

CHARACTERISTICS

CASE DIMENSIONS (mm)

Case Sixe

L

W

T

P

0201

0.60 ± 0.05

0.30 ± 0.05

0.23 ± 0.05

0.15 ± 0.05

0402

1.0 ± 0.05

0.5 ± 0.05

0.32 ± 0.05

0.20 ± 0.10

0603

1.6 ± 0.10

0.8 ± 0.10

0.45 ± 0.10

0.30 ± 0.20

L

P

T

W

CONSTRUCTION

Nickel-Chromium (Ni-Cr)

Termination Base

Nickel (Ni) Barrier

Tin (Sn) Outerplating

Alumina Substrate

Etched Copper Coil

LAND PATTERN DIMENSIONS (mm)

Case Sixe

A

B

C

D

0201

0.2 ~ 0.3

0.8 ~ 0.9

0.2 ~ 0.3

0.3 ~ 0.4

0402

0.5 ~ 0.6

1.5 ~ 1.8

0.5 ~ 0.6

0.5 ~ 0.6

0603

0.6 ~ 1.0

2.4 ~ 2.8

0.7 ~ 0.9

0.9 ~ 1.1

A

B

C

D

90 ~ 120 sec.

260°C max.

10 sec. max.

130°C ~ 180°C

REFLOW SOLDERING PROFILE

220°C

Time above 220°C -

60 sec. max.

50°C

100°C

150°C

200°C

250°C

Time (seconds)

*See Part Number System for Details

RoHS

Compliant

includes all homogeneous materials