TSL1401CS−LF

128 × 1 LINEAR SENSOR ARRAY WITH HOLD

TAOS072E − APRIL 2007

15

The LUMENOLOGY r Company

r

r

Copyright E 2007, TAOS Inc.

www.taosinc.com

MANUFACTURING INFORMATION

Not to scale — for reference only

Time (sec)

Figure 14. TSL1401CS−LF Solder Bump Linear Array Package Solder Profile

It is important to use a substrate that has an immersion plating surface. This may be immersion gold, silver, or

white tin. Hot air solder leveled substrates (HASL) are not coplanar and should not be used.

Qualified Equipment

− SIEMENS 912 — Vacuum Pickup Tool Nozzle

Qualified Materials