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AS3635

Datasheet - A b s o l u t e M a x i m u m R a t i n g s

5 Absolute Maximum Ratings

Stresses beyond those listed in Table 2 may cause permanent damage to the device. These are stress ratings only,

and functional operation of the device at these or any other conditions beyond those indicated in Table 3, “Electrical

Characteristics,” on page 4 is not implied. Exposure to absolute maximum rating conditions for extended periods may

affect device reliability.

Table 2. Absolute Maximum Ratings

Parameter

Min

Max

Units

Comments

VBAT, V5V to GND

-0.3

+7.0

V

CHARGE, DONE, FLASH to GND

-0.3

VBAT +

0.3

V

maximum 7.0V

IGBT_GATE to GND

-0.3

V5V +

0.3

V

SW to PGND

-0.3

+55.0

V

PGND to GND

0.0

0.0

V

Connect PGND to GND directly below

the pad (short connection

recommended)

Input Pin Current without causing latchup

-100

+100

mA

Norm: EIA/JESD78

Continuous power dissipation

0.76

W

1

1. Depending on actual PCB layout and PCB used

Electrostatic Discharge

ESD pins VBAT, CHARGE, DONE, FLASH

2

required; system test for completed module (fully capsuled), no permanent interruption of operation

±15000

V

Air Discharge to module;

IEC 61000 -4 -2 test bench

±8000

V

Contact Test to module;

IEC 61000 -4 -2 test bench

ESD HBM pins SW, IGBT_GATE, PGND, V5V

±2000

V

Norm: MIL 883 E Method 3015

ESD CDM

±500

V

Norm: JEDEC JESD 22-C101C

ESD MM

±100

V

Norm: JEDEC JESD 22-A115-A level A

Temperature Ranges and Storage Conditions

Storage Temperature Range

-55

+125

ºC

Humidity

5

85

%

Non condensing

Body Temperature during Soldering

+260

ºC

according to IPC/JEDEC J-STD-020

Moisture Sensitivity Level (MSL)

MSL 1

Represents a max. floor life time of

unlimited