| Electronic Components Datasheet Search |
|
HDMP-1526 Datasheet(PDF) 13 Page - Agilent(Hewlett-Packard) |
|
|
|||||||||||||||||||||||||||||
HDMP-1526 Datasheet(HTML) 13 Page - Agilent(Hewlett-Packard) |
|
13 / 14 page ![]() 694 Transceiver Package Information The HDMP-1526 is constructed of a single integrated circuit packaged in a 14x14 mm EDQuad package. This package was designed to provide enhanced power dissipation, thus allowing for smaller package dimensions. The package conforms to the industry standard JEDEC land pattern for 14x14 mm devices. As shown in Figure 12, the die is attached to a copper heatsink using thermally conductive epoxy. This allows for the power dissipated by the IC to be directly connected to the ambient environment, thereby minimizing the Θjc of the device. Figure 12. Power Supply Bypass. RXCAP0 VCC_RXTTL VCC_RXTTL TOP VIEW GND_RXTTL GND_TXTTL VCC_TXTTL VCC_TXTTL GND_TXTTL GND_TXA TXCAP0 * SUPPLY VOLTAGE INTO VCC_RXA AND VCC_TXA SHOULD BE FROM A LOW NOISE SOURCE. ALL BYPASS CAPACITORS ARE 0.1 µF. THE PLL FILTER CAPACITORS ARE 0.01 µF. VCC VCC VCC VCC* VCC VCC VCC GND_RXTTL VCC CPLLT VCC* VCC VCC VCC VCC CPLLR Transceiver Power Supply Bypass and Loop Filter Capacitors Bypass capacitors should be liberally used and placed as close as possible to the appropriate power supply pins of the HDMP- 1526 as shown on the schematic of Figure 11. All bypass chip capacitors are 0.1 µF. The VCC_RXA and VCC_TXA pins are the analog power supply pins for the PLL sections. The voltage into these pins should be clean with minimum noise. The PLL loop filter capacitors and their pin locations are also shown on Figure 11. Notice that only two capacitors are required: CPLLT for the transmitter and CPLLR for the receiver. Nominal capacitance is 0.01 µF. The voltage across the capacitors is on the order of 1 volt, so the capacitor can be a low voltage type and physically small. The PLL capacitors are placed physically close to the appropriate pins on the HDMP- 1526. Keeping the lines short will prevent them from picking up stray noise from surrounding lines or components. COPPER HEATSINK NICKEL PLATING CERAMIC LEAD DIE WIRE BOND Figure 13. Package Cross Section of HDMP-1526. |
|
|
Link URL |
| Does ALLDATASHEET help your business so far? [ DONATE ] |
About Alldatasheet | Advertisement | Contact us | Privacy Policy | Link to Datasheet | Link Exchange | Manufacturer List All Rights Reserved©Alldatasheet.com |
| Russian : Alldatasheetru.com | Korean : Alldatasheet.co.kr | Spanish : Alldatasheet.es | French : Alldatasheet.fr | Italian : Alldatasheetit.com Portuguese : Alldatasheetpt.com | Polish : Alldatasheet.pl | Vietnamese : Alldatasheet.vn Indian : Alldatasheet.in | Mexican : Alldatasheet.com.mx | British : Alldatasheet.co.uk | New Zealand : Alldatasheet.co.nz |
|
Family Site : ic2ic.com |
icmetro.com |