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ICS5342 Datasheet(PDF) 32 Page - Integrated Circuit Systems

Part # ICS5342
Description  16-Bit Integrated Clock-LUT-DAC
PDF  36 Pages
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Manufacturer  ICST [Integrated Circuit Systems]
Direct Link  http://www.icst.com
Logo ICST - Integrated Circuit Systems

ICS5342 Datasheet(HTML) 32 Page - Integrated Circuit Systems

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ICS5342
GENDAC
32
Recommended Layout
VIA to power plane
VIA to ground plane
PCLK
XVDD
XGND
XOUT
XIN
60
59
58
57
56
55
54
53
52
51
50
49
48
47
46
45
44
GENDAC II
ICS5342
CLK1
DGND
10
11
12
13
14
15
16
17
18
19
20
21
22
23
24
25
26
R4
R2
R2
R4
R5
R1
C2
C2
VAA
C1
FB1
C3
C1 0.047
µF chip capacitor
C2 0.1
µF chip capacitor
C3 10
µF tantalum capacitor
FB1 ferrite bead, Fair-Rite 2743019447
R1 33 ohm
R2 100 ohm
R3 141 ohm, 1%
R4 220 ohm
R5 560 ohm
Y1 parallel resonant crystal cut for C
L = 12 pF
C2
LOCATE NEAR
CONTROLLER
LOCATE NEAR
CONTROLLER
C1
C2
R3
VAA
C2
Y1
VAA
C2
VREF
CGND
DGND
5342_30
Board Layout and Analog Signal Consider-
ations
The high performance of the GENDAC is dependent on care-
ful PC board layout. The use of a four layer board (internal
power and ground planes, signals on the two surface layers) is
recommended. The ground plane layer should be closest to the
component side of the board. The layout following this sec-
tion shows a suggested configuration.
Power Supply
As a high speed CMOS device, the GENDAC may draw large
transient currents from the power supply. It is necessary to
adopt high-frequency board-layout and power-distribution
techniques to assure proper operation of the GENDAC. This
will also minimize radio frequency interference (RFI). DAC
to DAC crosstalk can also be attributed to a high impedance
power supply.



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