RJP1CS08DWT / RJP1CS08DWA

R07DS0831EJ0300 Rev.3.00

Page 3 of 3

Oct 20, 2014

Die Dimension

Unit: mm

Illustration

Part of white

Part of dotted line

Part of gray

Note 1.

Note 2.

The back of the chip is processed with Au evaporation.

Note 3.

Recognition, target and any other patterns which are not related to

IGBT operation, may be changed without notice.

Definition

Al pattern

Bonding area

Final passivation

11.9

10.25

1.31

8.88

Emitter bonding pad (1)

Emitter bonding pad (4)

Emitter bonding pad (3)

Emitter bonding pad (2)

Gate

bonding pad

Ordering Information

Orderable Part Number

RJP1CS08DWA-80#W0

RJP1CS08DWT-80#X0