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R2A20114AFPASP Datasheet(PDF) 7 Page - Renesas Technology Corp

Part # R2A20114AFPASP
Description  Continuous Conduction Mode Interleaving PFC Control IC
PDF  17 Pages
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Manufacturer  RENESAS [Renesas Technology Corp]
Direct Link  http://www.renesas.com
Logo RENESAS - Renesas Technology Corp

R2A20114AFPASP Datasheet(HTML) 7 Page - Renesas Technology Corp

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R2A20114AFP/ASP
Preliminary
R03DS0051EJ0100 Rev.1.00
Page 7 of 16
Aug 29, 2011
Absolute Maximum Ratings
Item
Symbol
Value
Unit
Note
Supply voltage
VCC
–0.3 to +24
V
3
Peak current
Ipk-gd1, Ipk-gd2
1
A
3, 4
GD1 and 2
DC current
Idc-gd1, Idc-gd2
0.1
A
3
Vref terminal current
Iref
–5
mA
3
Terminal current
It-group
1
mA
3, 5
RS terminal current
Irs
–500
A
3
RT terminal current
Irt
–200
A
3
IRAMP terminal current
Iramp
–200
A
3
BO clamp current
Ibo
300
A
3
Terminal voltage
Vt-group
–0.3 to Vref
V
3, 6
Vref terminal voltage
Vt-ref
–0.3 to Vref+0.3
V
3
SS terminal voltage
Vt-ss
–0.3 to Vref+1
V
3
Power dissipation
Pt
1
W
3, 7
Operating junction temperature
Tj-opr
–40 to +150
°C
Storage temperature
Tstg
–55 to +150
°C
Notes: 1. Rated voltages are with reference to the AGND and PGND terminal.
2. For the direction of Rated currents, (+) denotes the current flowing into the IC, and (–) denotes the current
flowing out of the IC.
3. Ambience temperature, Ta is 25 degrees centigrade.
4. Transient current when driving a capacitive load.
5. Rated currents of the terminals listed below:
COMP, CSO1, CSO2
6. Rated voltages of the terminals listed below:
in the case of R2A20114AFP: CS1, CS2, VAC, RS, FB, PD, BO, ERROR, E-DLAY, OFF, OVP2, FMC, FMR,
RT/SYNC, IRAMP, SYNC-O, CT, COMP, CSO1, CSO2
in the case of R2A20114ASP: CS1, CS2, VAC, RS, FB, BO, IRAMP, FM, RT/SYNC, CT, COMP, CSO1,
CSO2
7. Thermal resistor
in the case of R2A20114AFP:
ja = 85.3 degrees centigrade/W
in the case of R2A20114ASP:
ja = 120 degrees centigrade/W
These values are obtained under the condition that the IC is mounted on the glass epoxy board, of which size
is 50
 50  1.6 [mm] and wiring density is 10%.



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